Satoshi Nihei

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Kyoto, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of sealing electronic parts with molded resin and mold emplo...
- Patent number 5,753,538
- Issue date May 19, 1998
- Towa Corporation
- Takaki Kuno
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL