TREA

Satoshi Ohkawara

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Conveyance system
    • Patent number 11,365,062
    • Issue date Jun 21, 2022
    • Disco Corporation
    • Satoshi Ohkawara
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Conveying mechanism
    • Patent number 10,622,237
    • Issue date Apr 14, 2020
    • Disco Corporation
    • Kazunari Tanaka
    • B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
  • Information Patent Grant

    Rectangular substrate dividing apparatus
    • Patent number 7,644,747
    • Issue date Jan 12, 2010
    • Disco Corporation
    • Satoshi Ohkawara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor wafer processing machine
    • Patent number 7,329,079
    • Issue date Feb 12, 2008
    • Disco Corporation
    • Satoshi Ohkawara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Cleaning apparatus
    • Patent number 6,386,466
    • Issue date May 14, 2002
    • Disco Corporation
    • Naritoshi Ozawa
    • B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

  • Information Patent Application

    CUTTING BLADE STOCK APPARATUS
    • Publication number 20240033867
    • Publication date Feb 1, 2024
    • Disco Corporation
    • Aimi YAMATO
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    CONVEYANCE SYSTEM
    • Publication number 20200172345
    • Publication date Jun 4, 2020
    • Disco Corporation
    • Satoshi OHKAWARA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONVEYING MECHANISM
    • Publication number 20190326135
    • Publication date Oct 24, 2019
    • Disco Corporation
    • Kazunari TANAKA
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Rectangular substrate dividing apparatus
    • Publication number 20060113595
    • Publication date Jun 1, 2006
    • DISCO CORPORATION
    • Satoshi Ohkawara
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor wafer processing machine
    • Publication number 20040265100
    • Publication date Dec 30, 2004
    • Satoshi Ohkawara
    • H01 - BASIC ELECTRIC ELEMENTS