Satoshi Ookawa

Person

Kumamoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate processing system and substrate processing method
- Patent number 12,255,063
- Issue date Mar 18, 2025
- Tokyo Electron Limited
- Hayato Tanoue
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus, and bonding system
- Patent number 9,486,989
- Issue date Nov 8, 2016
- Tokyo Electron Limited
- Satoshi Ookawa
- G02 - OPTICS
Information Patent Grant
Bonding apparatus, bonding system and bonding method
- Patent number 9,469,093
- Issue date Oct 18, 2016
- Tokyo Electron Limited
- Norio Wada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Bonding method, bonding apparatus and bonding system
- Patent number 9,165,803
- Issue date Oct 20, 2015
- Tokyo Electron Limited
- Goro Furutani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Bonding apparatus, bonding system and bonding method
- Patent number 9,005,385
- Issue date Apr 14, 2015
- Tokyo Electron Limited
- Norio Wada
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20250191905
- Publication date Jun 12, 2025
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20210296119
- Publication date Sep 23, 2021
- TOKYO ELECTRON LIMITED
- Hayato TANOUE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
- Publication number 20210280429
- Publication date Sep 9, 2021
- TOKYO ELECTRON LIMITED
- Satoshi OOKAWA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM
- Publication number 20140338813
- Publication date Nov 20, 2014
- TOKYO ELECTRON LIMITED
- Satoshi OOKAWA
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS AND BONDING SYSTEM
- Publication number 20140329341
- Publication date Nov 6, 2014
- TOKYO ELECTRON LIMITED
- Goro Furutani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD
- Publication number 20140318680
- Publication date Oct 30, 2014
- TOKYO ELECTRON LIMITED
- Norio Wada
- B32 - LAYERED PRODUCTS
Information Patent Application
BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD
- Publication number 20140318711
- Publication date Oct 30, 2014
- TOKYO ELECTRON LIMITED
- Norio Wada
- B32 - LAYERED PRODUCTS

Satoshi Ookawa

Person

Patents Grantslast 30 patents

Substrate processing system and substrate processing method

Bonding method, bonding apparatus, and bonding system

Bonding apparatus, bonding system and bonding method

Bonding method, bonding apparatus and bonding system

Bonding apparatus, bonding system and bonding method

Patents Applicationslast 30 patents

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD

BONDING METHOD, BONDING APPARATUS, AND BONDING SYSTEM

BONDING METHOD, BONDING APPARATUS AND BONDING SYSTEM

BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD

BONDING APPARATUS, BONDING SYSTEM AND BONDING METHOD