Satoshi Sendai

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Plating apparatus and plating liquid removing method
- Patent number 7,241,372
- Issue date Jul 10, 2007
- Ebara Corporation
- Satoshi Sendai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus and method
- Patent number 7,166,204
- Issue date Jan 23, 2007
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate plating method and apparatus
- Patent number 7,033,463
- Issue date Apr 25, 2006
- Ebara Corporation
- Akihisa Hongo
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate plating apparatus and method
- Patent number 6,793,794
- Issue date Sep 21, 2004
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating apparatus and plating liquid removing method
- Patent number 6,689,216
- Issue date Feb 10, 2004
- Ebara Corporation
- Satoshi Sendai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Plating apparatus and method
- Patent number 6,660,139
- Issue date Dec 9, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for plating substrate and plating facility
- Patent number 6,558,518
- Issue date May 6, 2003
- Ebara Corporation
- Satoshi Sendai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating device
- Patent number 6,517,689
- Issue date Feb 11, 2003
- Ebara Corporation
- Akihisa Hongo
- G01 - MEASURING TESTING
Information Patent Grant
Plating apparatus for detecting the conductivity between plating co...
- Patent number 6,500,317
- Issue date Dec 31, 2002
- Ebara Corporation
- Junichiro Yoshioka
- G01 - MEASURING TESTING
Information Patent Grant
Substrate plating device
- Patent number 6,365,017
- Issue date Apr 2, 2002
- Ebara Corporation
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wafer plating jig
- Patent number 6,365,020
- Issue date Apr 2, 2002
- Ebara Corporation
- Junichiro Yoshioka
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroconductive composite ceramics
- Patent number 4,110,260
- Issue date Aug 29, 1978
- Tokyo Denki Kagaku Kogyo Kabushiki Kaisha (TDK Electronics Co., Ltd.)
- Hirotaka Yamamoto
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Plating apparatus and method
- Publication number 20060185976
- Publication date Aug 24, 2006
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating method and apparatus
- Publication number 20060144714
- Publication date Jul 6, 2006
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating liquid removing method
- Publication number 20040129575
- Publication date Jul 8, 2004
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20040089555
- Publication date May 13, 2004
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and method
- Publication number 20030057098
- Publication date Mar 27, 2003
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate plating apparatus
- Publication number 20020139683
- Publication date Oct 3, 2002
- Akihisa Hongo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating liquid removing method
- Publication number 20020017465
- Publication date Feb 14, 2002
- Satoshi Sendai
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Satoshi Sendai

Person

Patents Grantslast 30 patents

Plating apparatus and plating liquid removing method

Plating apparatus and method

Substrate plating method and apparatus

Substrate plating apparatus and method

Plating apparatus and plating liquid removing method

Plating apparatus and method

Method and apparatus for plating substrate and plating facility

Plating device

Plating apparatus for detecting the conductivity between plating co...

Substrate plating device

Wafer plating jig

Electroconductive composite ceramics

Patents Applicationslast 30 patents

Plating apparatus and method

Substrate plating method and apparatus

Plating apparatus and plating liquid removing method

Plating apparatus and method

Plating apparatus and method

Substrate plating apparatus

Plating apparatus and plating liquid removing method