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Satoshi Tanigawa
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Osaka, JP
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Patents Grants
last 30 patents
Information
Patent Grant
Photosensitive resin composition and use of the same
Patent number
7,008,752
Issue date
Mar 7, 2006
Nitto Denko Corporation
Hirofumi Fujii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Process for manufacturing a printed wiring board
Patent number
6,904,674
Issue date
Jun 14, 2005
Nitto Denko Corporation
Kazunori Mune
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multi-layer wiring circuit board and method for producing the same
Patent number
6,902,949
Issue date
Jun 7, 2005
Nitto Denko Corporation
Hiroshi Yamazaki
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multilayer flexible wiring circuit board and its manufacturing method
Patent number
6,887,560
Issue date
May 3, 2005
Nitto Denko Corporation
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing multilayer wiring circuit board
Patent number
6,851,599
Issue date
Feb 8, 2005
Nitto Denko Corporation
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method of producing multilayer printed wiring board
Patent number
6,772,515
Issue date
Aug 10, 2004
Hitachi, Ltd.
Tokihito Suwa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Process for manufacturing printed wiring board using metal plating...
Patent number
6,662,442
Issue date
Dec 16, 2003
Nitto Denko Corporation
Kouji Matsui
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for producing multilayer circuit board
Patent number
6,591,491
Issue date
Jul 15, 2003
Nitto Denko Corporation
Hirofumi Fujii
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Interposer for chip size package and method for manufacturing the same
Patent number
6,379,159
Issue date
Apr 30, 2002
Nitto Denko Corporation
Kazunori Mune
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Photosensitive resin composition and adhesive
Patent number
6,300,037
Issue date
Oct 9, 2001
Nitto Denko Corporation
Hirofumi Fujii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Modified alkyl-terminated encapsulant for semiconductor of epoxy re...
Patent number
6,001,483
Issue date
Dec 14, 1999
Nitto Denko Corporation
Tadaaki Harada
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Grant
Chip scale package type of semiconductor device
Patent number
5,990,546
Issue date
Nov 23, 1999
Nitto Denko Corporation
Kazumasa Igarashi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device, production method thereof, and tape carrier f...
Patent number
5,814,894
Issue date
Sep 29, 1998
Nitto Denko Corporation
Kazumasa Igarashi
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Photosensitive resin composition and use of the same
Publication number
20050208421
Publication date
Sep 22, 2005
NITTO DENKO CORPORATION
Hirofumi Fujii
C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information
Patent Application
Multilayer flexible wiring circuit board and its manufacturing method
Publication number
20040035520
Publication date
Feb 26, 2004
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Method for producing multilayer wiring circuit board
Publication number
20040011855
Publication date
Jan 22, 2004
Kei Nakamura
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Multi-layer wiring circuit board and method for producing the same
Publication number
20020140076
Publication date
Oct 3, 2002
NITTO DENKO CORPORATION
Hiroshi Yamazaki
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Printed wiring board and production thereof
Publication number
20020108781
Publication date
Aug 15, 2002
NITTO DENKO CORPORATION
Kazunori Mune
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method of producing multilayer printed wiring board and multilayer...
Publication number
20020056192
Publication date
May 16, 2002
Tokihito Suwa
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Application
Method for producing multilayer circuit board
Publication number
20010023532
Publication date
Sep 27, 2001
Hirofumi Fujii
H01 - BASIC ELECTRIC ELEMENTS