Satoshi Tateiwa

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Liquid jet machining apparatus
- Patent number 7,052,378
- Issue date May 30, 2006
- Disco Corporation
- Satoshi Tateiwa
- B24 - GRINDING POLISHING
Information Patent Grant
Water jet processing method
- Patent number 6,982,211
- Issue date Jan 3, 2006
- Disco Corporation
- Koichi Yajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor wafer dividing method
- Patent number 6,593,170
- Issue date Jul 15, 2003
- Disco Corporation
- Satoshi Tateiwa
- B28 - WORKING CEMENT, CLAY, OR STONE

Patents Applicationslast 30 patents

Information Patent Application
Abrasive water jet cutting machine
- Publication number 20070037495
- Publication date Feb 15, 2007
- Masayuki Matsubara
- B24 - GRINDING POLISHING
Information Patent Application
Liquid jet machining apparatus
- Publication number 20050252352
- Publication date Nov 17, 2005
- DISCO CORPORATION
- Satoshi Tateiwa
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Liquid jet machining apparatus
- Publication number 20050202764
- Publication date Sep 15, 2005
- DISCO CORPORATION
- Satoshi Tateiwa
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
Water jet processing method
- Publication number 20050196940
- Publication date Sep 8, 2005
- Koichi Yajima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plate-like carrying mechanism and dicing device with carrying mecha...
- Publication number 20040099112
- Publication date May 27, 2004
- Naoki Ohmiya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer dividing method
- Publication number 20010041387
- Publication date Nov 15, 2001
- Satoshi Tateiwa
- B28 - WORKING CEMENT, CLAY, OR STONE