TREA

Satoshi Tawara

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  • Nagasaki-shi, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Room temperature bonding apparatus
    • Patent number 9,005,390
    • Issue date Apr 14, 2015
    • Mitsubishi Heavy Industries, Ltd.
    • Takeshi Tsuno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Room temperature bonding machine and room temperature bonding method
    • Patent number 8,985,175
    • Issue date Mar 24, 2015
    • Mitsubishi Heavy Industries, Ltd.
    • Masato Kinouchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Room temperature bonding apparatus
    • Patent number 8,906,175
    • Issue date Dec 9, 2014
    • Mitsubishi Heavy Industries, Ltd.
    • Masato Kinouchi
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Room temperature bonding apparatus
    • Patent number 8,857,487
    • Issue date Oct 14, 2014
    • Mitsubishi Heavy Industries, Ltd.
    • Takeshi Tsuno
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer bonding apparatus
    • Patent number 8,578,993
    • Issue date Nov 12, 2013
    • Mitsubishi Heavy Industries, Ltd.
    • Satoshi Tawara
    • Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Information Patent Grant

    Grinding swarf collector
    • Patent number 6,267,657
    • Issue date Jul 31, 2001
    • Mitsubishi Heavy Industries, Ltd.
    • Satoshi Tawara
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents