Satoshi Teshima

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Saga, JP

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Patents Grantslast 30 patents

Information Patent Grant
Ag—Au—Pd ternary alloy bonding wire
- Patent number 9,103,001
- Issue date Aug 11, 2015
- Tanaka Denshi Kogyo K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Au bonding wire for semiconductor device
- Patent number 8,440,137
- Issue date May 14, 2013
- Tanaka Denshi Kogyo K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold alloy wire for ball bonding
- Patent number 8,147,750
- Issue date Apr 3, 2012
- Tanaka Denshi Kogyo K.K.
- Mitsuo Takada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Ag-Au-Pd TERNARY ALLOY BONDING WIRE
- Publication number 20120263624
- Publication date Oct 18, 2012
- TANAKA DENSHI KOGYO K.K.
- Jun Chiba
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
AU ALLOY WIRE FOR BALL BONDING
- Publication number 20100314156
- Publication date Dec 16, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
GOLD ALLOY WIRE FOR BALL BONDING
- Publication number 20100226816
- Publication date Sep 9, 2010
- TANAKA DENSHI KOGYO K.K.
- Mitsuo Takada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Au Alloy Bonding Wire
- Publication number 20080050267
- Publication date Feb 28, 2008
- Hiroshi Murai
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Au Bonding Wire For Semiconductor Device
- Publication number 20070298276
- Publication date Dec 27, 2007
- TANAKA DENSHI KOGYO K.K.
- Satoshi Teshima
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...