Satoshi Uematsu

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Hitachi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Grinding abrasive grains, abrasive, abrasive solution, abrasive sol...
- Patent number 7,267,604
- Issue date Sep 11, 2007
- Hitachi Cable, Ltd.
- Chie Yoshizawa
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor wafer cleaning method and wafer cleaned by same method
- Publication number 20060185688
- Publication date Aug 24, 2006
- HITACHI CABLE, LTD.
- Satoshi Uematsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Grinding abrasive grains, abrasive, abrasive solution, abrasive sol...
- Publication number 20050205836
- Publication date Sep 22, 2005
- HITACHI CABLE, LTD.
- Chie Yoshizawa
- B24 - GRINDING POLISHING