Satoshi Yanaura

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of producing a multi-layered wiring board
- Patent number 7,100,275
- Issue date Sep 5, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Toshiyuki Toyoshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device
- Patent number 6,700,073
- Issue date Mar 2, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Seiki Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing multi-layer printed wiring board
- Patent number 6,664,127
- Issue date Dec 16, 2003
- Mitsubishi Denki Kabushiki Kaisha
- Seiji Oka
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multi-layer printed wiring board
- Patent number 6,451,710
- Issue date Sep 17, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Seiji Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moistureproof structure for module circuits
- Patent number 5,276,414
- Issue date Jan 4, 1994
- Mitsubishi Denki Kabushiki Kaisha
- Takamitsu Fujimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotary drum device having a head drive with positively bonded bobbi...
- Patent number 4,985,794
- Issue date Jan 15, 1991
- Mitsubishi Denki Kabushiki Kaisha
- Naoki Kato
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Method of producing a multi-layered wiring board
- Publication number 20050003076
- Publication date Jan 6, 2005
- Mitsubishi Denki Kabushiki Kaisha
- Toshiyuki Toyoshima
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20020070439
- Publication date Jun 13, 2002
- Mitsubishi Denki Kabushiki Kaisha
- Seiki Hiramatsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multi-layer printed wiring board
- Publication number 20020023343
- Publication date Feb 28, 2002
- Seiji Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multi-layer printed wiring board
- Publication number 20020016018
- Publication date Feb 7, 2002
- Seiji Oka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a multi-layered wiring board
- Publication number 20010025414
- Publication date Oct 4, 2001
- Toshiyuki Toyoshima
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC