Satoshi Yasuda

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Aichi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Bonding area design for transient liquid phase bonding process
- Patent number 8,803,001
- Issue date Aug 12, 2014
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
BONDING AREA DESIGN FOR TRANSIENT LIQUID PHASE BONDING PROCESS
- Publication number 20120325539
- Publication date Dec 27, 2012
- Toyota Motor Engineering & Manufacturing North America, Inc.
- Sang Won Yoon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR