Satya Chillara

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Ultra-thin composite package for integrated circuits
- Patent number 6,184,575
- Issue date Feb 6, 2001
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit package including interposer
- Patent number 5,790,378
- Issue date Aug 4, 1998
- National Semiconductor Corporation
- Satya N. Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit package assembly with a heatsink be...
- Patent number 5,739,581
- Issue date Apr 14, 1998
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal ball lead integrated package
- Patent number 5,705,851
- Issue date Jan 6, 1998
- National Semiconductor Corporation
- Shahram Mostafazadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component package assembly including an integral RF/E...
- Patent number 5,650,659
- Issue date Jul 22, 1997
- National Semiconductor Corporation
- Shahram Mostafazadeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tape ball lead integrated circuit package
- Patent number 5,648,679
- Issue date Jul 15, 1997
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assembly incorporating an anisotropic elecctrica...
- Patent number 5,627,405
- Issue date May 6, 1997
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit assembly combining leadframe leads...
- Patent number 5,569,955
- Issue date Oct 29, 1996
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer connecting leadframe and integrated circuit
- Patent number 5,569,956
- Issue date Oct 29, 1996
- National Semiconductor Corporation
- Satya N. Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame having layered conductive planes
- Patent number 5,498,901
- Issue date Mar 12, 1996
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density integrated circuit assembly combining leadframe leads...
- Patent number 5,442,230
- Issue date Aug 15, 1995
- National Semiconductor Corporation
- Satya Chillara
- H01 - BASIC ELECTRIC ELEMENTS

Satya Chillara

Person

Patents Grantslast 30 patents

Ultra-thin composite package for integrated circuits

High density integrated circuit package including interposer

High density integrated circuit package assembly with a heatsink be...

Thermal ball lead integrated package

Semiconductor component package assembly including an integral RF/E...

Tape ball lead integrated circuit package

Integrated circuit assembly incorporating an anisotropic elecctrica...

High density integrated circuit assembly combining leadframe leads...

Interposer connecting leadframe and integrated circuit

Lead frame having layered conductive planes

High density integrated circuit assembly combining leadframe leads...