Satyam C. Cherukuri

Person

West Haven, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Glass/ceramic sealing system
- Patent number 5,047,371
- Issue date Sep 10, 1991
- Olin Corporation
- Satyam C. Cherukuri
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Metal sealing glass composite with matched coefficients of thermal...
- Patent number 5,043,222
- Issue date Aug 27, 1991
- Olin Corporation
- Satyam C. Cherukuri
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor die attach system
- Patent number 4,978,052
- Issue date Dec 18, 1990
- Olin Corporation
- Julius C. Fister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sealing glass for matched sealing of copper and copper alloys
- Patent number 4,952,531
- Issue date Aug 28, 1990
- Olin Corporation
- Satyam C. Cherukuri
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Semiconductor die attach system
- Patent number 4,929,516
- Issue date May 29, 1990
- Olin Corporation
- Michael J. Pryor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die attach system
- Patent number 4,872,047
- Issue date Oct 3, 1989
- Olin Corporation
- Julius C. Fister
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor casing
- Patent number 4,796,083
- Issue date Jan 3, 1989
- Olin Corporation
- Satyam C. Cherukuri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing a hermetically sealed package for an electric...
- Patent number 4,769,345
- Issue date Sep 6, 1988
- Olin Corporation
- Sheldon H. Butt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graded sealing systems for semiconductor package
- Patent number 4,704,626
- Issue date Nov 3, 1987
- Olin Corporation
- Deepak Mahulikar
- H01 - BASIC ELECTRIC ELEMENTS

Satyam C. Cherukuri

Person

Patents Grantslast 30 patents

Glass/ceramic sealing system

Metal sealing glass composite with matched coefficients of thermal...

Semiconductor die attach system

Sealing glass for matched sealing of copper and copper alloys

Semiconductor die attach system

Semiconductor die attach system

Semiconductor casing

Process for producing a hermetically sealed package for an electric...

Graded sealing systems for semiconductor package