Satyavolu Srinivas Papa Rao

Person

Garland, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Properties of metallic copper diffusion barriers through silicon su...
- Patent number 8,211,794
- Issue date Jul 3, 2012
- Texas Instruments Incorporated
- Valli Arunachalam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication of on-chip heat pipes and ancillary heat tran...
- Patent number 7,781,884
- Issue date Aug 24, 2010
- Texas Instruments Incorporated
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Energy beam treatment to improve packaging reliability
- Patent number 7,678,713
- Issue date Mar 16, 2010
- Texas Instruments Incorporated
- Ting Y. Tsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Air gap in integrated circuit inductor fabrication
- Patent number 7,566,627
- Issue date Jul 28, 2009
- Texas Instruments Incorporated
- Phillip D Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices employing metal layers in gates to introduce ch...
- Patent number 7,531,398
- Issue date May 12, 2009
- Texas Instruments Incorporated
- Zhibo Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of pore sealing liner into dual-damascene methods and d...
- Patent number 7,338,893
- Issue date Mar 4, 2008
- Texas Instruments Incorporated
- Edward Raymond Engbrecht
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single mask MIM capacitor and resistor with in trench copper drift...
- Patent number 7,189,615
- Issue date Mar 13, 2007
- Texas Instruments Incorporated
- Satyavolu Srinivas Papa Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ferroelectric capacitor having a substantially planar dielectric la...
- Patent number 7,153,706
- Issue date Dec 26, 2006
- Texas Instruments Incorporated
- Sanjeev Aggarwal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dummy Contact Fill to Improve Post Contact Chemical Mechanical Poli...
- Publication number 20090087956
- Publication date Apr 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Satyavolu Srinivas Papa Rao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Tran...
- Publication number 20090085197
- Publication date Apr 2, 2009
- TEXAS INSTRUMENTS INCORPORATED
- Sameer Kumar Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP IN INTEGRATED CIRCUIT INDUCTOR FABRICATION
- Publication number 20090001510
- Publication date Jan 1, 2009
- Phillip D Matz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROPERTIES OF METALLIC COPPER DIFFUSION BARRIERS THROUGH SILICON SU...
- Publication number 20080290515
- Publication date Nov 27, 2008
- Valli Arunachalam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and devices employing metal layers in gates to introduce ch...
- Publication number 20080096338
- Publication date Apr 24, 2008
- TEXAS INSTRUMENTS INCORPORATED
- Zhibo Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Satyavolu Srinivas Papa Rao

Person

Patents Grantslast 30 patents

Properties of metallic copper diffusion barriers through silicon su...

Method of fabrication of on-chip heat pipes and ancillary heat tran...

Energy beam treatment to improve packaging reliability

Air gap in integrated circuit inductor fabrication

Methods and devices employing metal layers in gates to introduce ch...

Integration of pore sealing liner into dual-damascene methods and d...

Single mask MIM capacitor and resistor with in trench copper drift...

Ferroelectric capacitor having a substantially planar dielectric la...

Patents Applicationslast 30 patents

Dummy Contact Fill to Improve Post Contact Chemical Mechanical Poli...

Method of Fabrication of On-Chip Heat Pipes and Ancillary Heat Tran...

AIR GAP IN INTEGRATED CIRCUIT INDUCTOR FABRICATION

PROPERTIES OF METALLIC COPPER DIFFUSION BARRIERS THROUGH SILICON SU...

Methods and devices employing metal layers in gates to introduce ch...