Saul Ferguson

Person

Albuquerque, NM, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electrodes, inner layers, capacitors, electronic devices and method...
- Patent number 7,741,189
- Issue date Jun 22, 2010
- E. I. Du Pont de Nemours and Company
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power core devices
- Patent number 7,701,052
- Issue date Apr 20, 2010
- E. I. Du Pont de Nemours and Company
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods for forming process test capacitors for testing embedded pa...
- Patent number 7,649,361
- Issue date Jan 19, 2010
- E. I. Du Pont de Nemours and Company
- William Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Innerlayer panels and printed wiring boards with embedded fiducials
- Patent number 7,586,198
- Issue date Sep 8, 2009
- E. I. Du Pont de Nemours and Company
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making interlayer panels
- Patent number 7,178,229
- Issue date Feb 20, 2007
- E. I. Du Pont de Nemours and Company
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming printed circuit boards having embedded thick fil...
- Patent number 7,100,277
- Issue date Sep 5, 2006
- E. I. Du Pont de Nemours and Company
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Dielectric Oxide Films and Method for Making Same
- Publication number 20100311564
- Publication date Dec 9, 2010
- Mark Phillps
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
Methods for Forming Process Test Capacitors for Testing Embedded Pa...
- Publication number 20080145995
- Publication date Jun 19, 2008
- E.I. du Pont de Nemours and Company
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Power core devices and methods of making thereof
- Publication number 20070090511
- Publication date Apr 26, 2007
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrodes, inner layers, capacitors and printed wiring boards and...
- Publication number 20060282999
- Publication date Dec 21, 2006
- Diptarka Majumdar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrodes, inner layers, capacitors, electronic devices and method...
- Publication number 20060284280
- Publication date Dec 21, 2006
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed circuit boards having embedded thick film capacitors
- Publication number 20060254812
- Publication date Nov 16, 2006
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making innerlayer panels and printed wiring boards using...
- Publication number 20060101639
- Publication date May 18, 2006
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thick film capacitors, embedding thick-film capacitors inside print...
- Publication number 20060002097
- Publication date Jan 5, 2006
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of making innerlayer panels and printed wiring boards using...
- Publication number 20050111206
- Publication date May 26, 2005
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring boards having capacitors and methods of making thereof
- Publication number 20040231885
- Publication date Nov 25, 2004
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Printed wiring boards having low inductance embedded capacitors and...
- Publication number 20040108134
- Publication date Jun 10, 2004
- William J. Borland
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Saul Ferguson

Person

Patents Grantslast 30 patents

Electrodes, inner layers, capacitors, electronic devices and method...

Power core devices

Methods for forming process test capacitors for testing embedded pa...

Innerlayer panels and printed wiring boards with embedded fiducials

Method of making interlayer panels

Methods of forming printed circuit boards having embedded thick fil...

Patents Applicationslast 30 patents

Dielectric Oxide Films and Method for Making Same

Methods for Forming Process Test Capacitors for Testing Embedded Pa...

Power core devices and methods of making thereof

Electrodes, inner layers, capacitors and printed wiring boards and...

Electrodes, inner layers, capacitors, electronic devices and method...

Printed circuit boards having embedded thick film capacitors

Method of making innerlayer panels and printed wiring boards using...

Thick film capacitors, embedding thick-film capacitors inside print...

Method of making innerlayer panels and printed wiring boards using...

Printed wiring boards having capacitors and methods of making thereof

Printed wiring boards having low inductance embedded capacitors and...