Sayaka Hirafune

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,368,321
- Issue date May 6, 2008
- Fujikura Ltd.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for manufacturing the same
- Patent number 7,274,101
- Issue date Sep 25, 2007
- Fujikura Ltd.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with through-hole
- Patent number 7,180,149
- Issue date Feb 20, 2007
- Fujikura Ltd.
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD FOR THE SAME
- Publication number 20100117220
- Publication date May 13, 2010
- FUJIKURA LTD.
- Sayaka HIRAFUNE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20070264753
- Publication date Nov 15, 2007
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal filling process and metal filling apparatus
- Publication number 20060113057
- Publication date Jun 1, 2006
- FUJIKURA LTD.
- Sayaka Hirafune
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor package and method for manufacturing the same
- Publication number 20060001147
- Publication date Jan 5, 2006
- FUJIKURA LTD.
- Michikazu Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method of manufacturing same
- Publication number 20050056903
- Publication date Mar 17, 2005
- Satoshi Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS