Sayaka WAKIOKA

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Curable resin composition, adhesive, imide oligomer, imide oligomer...
- Patent number 11,802,177
- Issue date Oct 31, 2023
- Sekisui Chemical Co., Ltd.
- Kohei Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, adhesive, imide oligomer, imide oligomer...
- Patent number 11,753,499
- Issue date Sep 12, 2023
- Sekisui Chemical Co., Ltd.
- Kohei Takeda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Curable resin composition, cured product, adhesive, bonding film, c...
- Patent number 11,421,107
- Issue date Aug 23, 2022
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Conductive material, connection structure and method for producing...
- Patent number 11,101,052
- Issue date Aug 24, 2021
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive for mounting flip chip for use in a method for producing a...
- Patent number 9,748,195
- Issue date Aug 29, 2017
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device and adhesive for moun...
- Patent number 9,209,155
- Issue date Dec 8, 2015
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive for semiconductor bonding, adhesive film for semiconductor...
- Patent number 8,692,394
- Issue date Apr 8, 2014
- Sekisui Chemical Co., Ltd.
- Yangsoo Lee
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
CURABLE RESIN COMPOSITION, ADHESIVE, IMIDE OLIGOMER, IMIDE OLIGOMER...
- Publication number 20210130536
- Publication date May 6, 2021
- Sekisui Chemical Co., Ltd
- Kohei TAKEDA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, BONDING FILM, C...
- Publication number 20210130614
- Publication date May 6, 2021
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT S...
- Publication number 20210009749
- Publication date Jan 14, 2021
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING...
- Publication number 20190252089
- Publication date Aug 15, 2019
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MO...
- Publication number 20160272854
- Publication date Sep 22, 2016
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUN...
- Publication number 20160056120
- Publication date Feb 25, 2016
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUN...
- Publication number 20150064847
- Publication date Mar 5, 2015
- Sekisui Chemical Co., Ltd
- Sayaka Wakioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMIC...
- Publication number 20120326301
- Publication date Dec 27, 2012
- SEKISUI CHEMICAL CO., LTD.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR...
- Publication number 20120267803
- Publication date Oct 25, 2012
- Sekisui Chemical Co., Ltd
- Yangsoo Lee
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Sayaka WAKIOKA

Person

Patents Grantslast 30 patents

Curable resin composition, adhesive agent, adhesive film, circuit s...

Curable resin composition, adhesive, imide oligomer, imide oligomer...

Curable resin composition, adhesive, imide oligomer, imide oligomer...

Curable resin composition, cured product, adhesive, bonding film, c...

Conductive material, connection structure and method for producing...

Adhesive for mounting flip chip for use in a method for producing a...

Method for manufacturing semiconductor device and adhesive for moun...

Adhesive for semiconductor bonding, adhesive film for semiconductor...

Patents Applicationslast 30 patents

CURABLE RESIN COMPOSITION, ADHESIVE, IMIDE OLIGOMER, IMIDE OLIGOMER...

CURABLE RESIN COMPOSITION, CURED PRODUCT, ADHESIVE, BONDING FILM, C...

CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT S...

CONDUCTIVE MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING...

ADHESIVE FOR MOUNTING ELECTRONIC COMPONENT AND ADHESIVE FILM FOR MO...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUN...

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND ADHESIVE FOR MOUN...

THERMOSETTING RESIN COMPOSITION, FLIP-CHIP MOUNTING ADHESIVE, SEMIC...

ADHESIVE FOR SEMICONDUCTOR BONDING, ADHESIVE FILM FOR SEMICONDUCTOR...