Sayuri Hada

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,679,916
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing warpage of an organic substrate
- Patent number 10,595,399
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of stress in via structure
- Patent number 10,593,616
- Issue date Mar 17, 2020
- Tessera, Inc.
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of stress in via structure
- Patent number 10,325,839
- Issue date Jun 18, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit module and manufacturing method thereof
- Patent number 10,074,583
- Issue date Sep 11, 2018
- International Business Machines Corporation
- Akihiro Horibe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing warpage of an orgacnic substrate
- Patent number 9,967,971
- Issue date May 8, 2018
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of warpage of multilayered substrate or package
- Patent number 9,672,323
- Issue date Jun 6, 2017
- International Business Machines Corporation
- Sayuri Hada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method, apparatus, and structure for determining interposer thickness
- Patent number 9,568,405
- Issue date Feb 14, 2017
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Grant
Reduction of warpage of multilayered substrate or package
- Patent number 9,384,314
- Issue date Jul 5, 2016
- International Business Machines Corporation
- Sayuri Hada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sheet having high thermal conductivity and flexibility
- Patent number 9,179,579
- Issue date Nov 3, 2015
- International Business Machines Corporation
- Sayuri Hada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Mounting structure and mounting structure manufacturing method
- Patent number 9,099,315
- Issue date Aug 4, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE
- Publication number 20230154887
- Publication date May 18, 2023
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20190214339
- Publication date Jul 11, 2019
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE
- Publication number 20190053370
- Publication date Feb 14, 2019
- International Business Machines Corporation
- Sayuri Hada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20180366388
- Publication date Dec 20, 2018
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20180294214
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF STRESS IN VIA STRUCTURE
- Publication number 20180294213
- Publication date Oct 11, 2018
- International Business Machines Corporation
- Toyohiro Aoki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING WARPAGE OF AN ORGACNIC SUBSTRATE
- Publication number 20170142825
- Publication date May 18, 2017
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Application
REDUCTION OF WARPAGE OF MULTILAYERED SUBSTRATE OR PACKAGE
- Publication number 20160217247
- Publication date Jul 28, 2016
- International Business Machines Corporation
- Sayuri Hada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20160141218
- Publication date May 19, 2016
- International Business Machines Corporation
- Akihiro HORIBE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF WARPAGE OF MULTILAYERED SUBSTRATE OR PACKAGE
- Publication number 20150248516
- Publication date Sep 3, 2015
- International Business Machines Corporation
- Sayuri Hada
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD, APPARATUS, AND STRUCTURE FOR DETERMINING INTERPOSER THICKNESS
- Publication number 20150153406
- Publication date Jun 4, 2015
- International Business Machines Corporation
- Sayuri Hada
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD
- Publication number 20150021777
- Publication date Jan 22, 2015
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS
- Publication number 20130119536
- Publication date May 16, 2013
- International Business Machines Corporation
- Sayuri Hada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SHEET HAVING HIGH THERMAL CONDUCTIVITY AND FLEXIBILITY
- Publication number 20110198067
- Publication date Aug 18, 2011
- INTERNATIONAL BUSINESS MACHINES CORPORATION
- Sayuri Hada
- B32 - LAYERED PRODUCTS

Sayuri Hada

Person

Patents Grantslast 30 patents

Circuit module and manufacturing method thereof

Method of reducing warpage of an organic substrate

Reduction of stress in via structure

Reduction of stress in via structure

Circuit module and manufacturing method thereof

Method of reducing warpage of an orgacnic substrate

Reduction of warpage of multilayered substrate or package

Method, apparatus, and structure for determining interposer thickness

Reduction of warpage of multilayered substrate or package

Sheet having high thermal conductivity and flexibility

Mounting structure and mounting structure manufacturing method

Patents Applicationslast 30 patents

INJECTION MOLDED SOLDER HEAD WITH IMPROVED SEALING PERFORMANCE

REDUCTION OF STRESS IN VIA STRUCTURE

METHOD OF REDUCING WARPAGE OF AN ORGANIC SUBSTRATE

CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF

REDUCTION OF STRESS IN VIA STRUCTURE

REDUCTION OF STRESS IN VIA STRUCTURE

METHOD OF REDUCING WARPAGE OF AN ORGACNIC SUBSTRATE

REDUCTION OF WARPAGE OF MULTILAYERED SUBSTRATE OR PACKAGE

CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF

REDUCTION OF WARPAGE OF MULTILAYERED SUBSTRATE OR PACKAGE

METHOD, APPARATUS, AND STRUCTURE FOR DETERMINING INTERPOSER THICKNESS

MOUNTING STRUCTURE AND MOUNTING STRUCTURE MANUFACTURING METHOD

METHOD FOR FORMING STUDS USED FOR SELF-ALIGNMENT OF SOLDER BUMPS

SHEET HAVING HIGH THERMAL CONDUCTIVITY AND FLEXIBILITY