Schiess Klaus

Person

Allensbach, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,923,276
- Issue date Mar 5, 2024
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor assembly and method for fabric...
- Patent number 11,676,881
- Issue date Jun 13, 2023
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,605,577
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a laser-activatable mold compound
- Patent number 11,289,436
- Issue date Mar 29, 2022
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a bidirectional switch
- Patent number 11,217,510
- Issue date Jan 4, 2022
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with bond pad extensions formed on molded appe...
- Patent number 11,081,455
- Issue date Aug 3, 2021
- Infineon Technologies Austria AG
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing an SMD package with top side cooling
- Patent number 10,903,133
- Issue date Jan 26, 2021
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a semiconductor chip monolithically integrated wit...
- Patent number 10,763,246
- Issue date Sep 1, 2020
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package top-side-cooling
- Patent number 10,755,999
- Issue date Aug 25, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with flat contacts to prevent bottleneck
- Patent number 10,699,987
- Issue date Jun 30, 2020
- tInfineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including a compound semiconductor chip
- Patent number 10,698,021
- Issue date Jun 30, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SMD package with top side cooling
- Patent number 10,566,260
- Issue date Feb 18, 2020
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 10,418,319
- Issue date Sep 17, 2019
- Infineon Technologies AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component
- Patent number 10,290,566
- Issue date May 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a repeating footprint pattern
- Patent number 10,204,845
- Issue date Feb 12, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure and electronic component
- Patent number 10,109,609
- Issue date Oct 23, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interdigit device on leadframe for evenly distributed current flow
- Patent number 10,074,597
- Issue date Sep 11, 2018
- Infineon Technologies Austria AG
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having contact pins at short side edges
- Patent number 10,037,934
- Issue date Jul 31, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor component having inner and outer semiconductor compon...
- Patent number 9,991,183
- Issue date Jun 5, 2018
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and a method of manufacturing the same
- Patent number 9,961,798
- Issue date May 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor device including a sensing lead
- Patent number 9,952,273
- Issue date Apr 24, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and switch circuit
- Patent number 9,899,481
- Issue date Feb 20, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Top side cooling for GaN power device
- Patent number 9,881,862
- Issue date Jan 30, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier structure, chip package and method of manufacturing th...
- Patent number 9,824,958
- Issue date Nov 21, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with top side cooling heat sink thermal pathway
- Patent number 9,812,373
- Issue date Nov 7, 2017
- Infineon Technologies AG
- Christian Fachmann
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Lateral element isolation device
- Patent number 9,786,584
- Issue date Oct 10, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compound semiconductor device including a multilevel carrier
- Patent number 9,754,862
- Issue date Sep 5, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices including control and load leads of opposite...
- Patent number 9,748,166
- Issue date Aug 29, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device including multiple semiconductor chips and multiple carriers
- Patent number 9,735,078
- Issue date Aug 15, 2017
- Infineon Technologies AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an electronic component
- Patent number 9,620,472
- Issue date Apr 11, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR A LATERAL POWER TRANSISTOR
- Publication number 20240162136
- Publication date May 16, 2024
- Infineon Technologies Austria AG
- Kok Yau Chua
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Bidirectional Switch
- Publication number 20230197582
- Publication date Jun 22, 2023
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...
- Publication number 20220102253
- Publication date Mar 31, 2022
- Infineon Technologies Austria AG
- Thomas Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Including a Bidirectional Switch
- Publication number 20220093496
- Publication date Mar 24, 2022
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...
- Publication number 20210020539
- Publication date Jan 21, 2021
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package Having a Laser-Activatable Mold Compound
- Publication number 20200381380
- Publication date Dec 3, 2020
- Infineon Technologies Austria AG
- Chee Hong Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...
- Publication number 20200343205
- Publication date Oct 29, 2020
- Chan Lam Cha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Producing an SMD Package with Top Side Cooling
- Publication number 20200144150
- Publication date May 7, 2020
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Package Top-Side-Cooling
- Publication number 20190295920
- Publication date Sep 26, 2019
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package with Top Side Cooling
- Publication number 20190080980
- Publication date Mar 14, 2019
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMD Package
- Publication number 20180301398
- Publication date Oct 18, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Compound Semiconductor Chip
- Publication number 20180224496
- Publication date Aug 9, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERDIGIT DEVICE ON LEADFRAME FOR EVENLY DISTRIBUTED CURRENT FLOW
- Publication number 20180211904
- Publication date Jul 26, 2018
- Infineon Technologies Americas Corp.
- Eung San Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe and method of manufacturing the same
- Publication number 20180158758
- Publication date Jun 7, 2018
- Infineon Technologies Austria AG
- Ralf OTREMBA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Including a Bidirectional Switch
- Publication number 20180151481
- Publication date May 31, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having a Repeating Footprint Pattern
- Publication number 20180061745
- Publication date Mar 1, 2018
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Including a Semiconductor Chip Monolithically Integrated wit...
- Publication number 20170317001
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Redirecting solder material to visually inspectable package surface
- Publication number 20170278762
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Angela KESSLER
- G01 - MEASURING TESTING
Information Patent Application
Electronic Component and Switch Circuit
- Publication number 20170207306
- Publication date Jul 20, 2017
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing an Electronic Component
- Publication number 20160372439
- Publication date Dec 22, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound Semiconductor Device Including a Sensing Lead
- Publication number 20160293549
- Publication date Oct 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING CONTROL AND LOAD LEADS OF OPPOSITE...
- Publication number 20160293528
- Publication date Oct 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Compound Semiconductor Device Including a Multilevel Carrier
- Publication number 20160293543
- Publication date Oct 6, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package Having Contact Pins at Short Side Edges
- Publication number 20160233149
- Publication date Aug 11, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Spreader, Electronic Module Comprising a Heat Spreader and Met...
- Publication number 20160163616
- Publication date Jun 9, 2016
- INFINEON TECHNOLOGIES AG
- Christian Fachmann
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Semiconductor Component Having Inner and Outer Semiconductor Compon...
- Publication number 20160111346
- Publication date Apr 21, 2016
- Infineon Technologies Austria AG
- Josef Hoeglauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086897
- Publication date Mar 24, 2016
- Infineon Technologies Austria AG
- Oliver Haeberlen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086878
- Publication date Mar 24, 2016
- Infineon Technologies Austria AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Component
- Publication number 20160086876
- Publication date Mar 24, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20160064255
- Publication date Mar 3, 2016
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS

Schiess Klaus

Person

Patents Grantslast 30 patents

Semiconductor device including a bidirectional switch

Semiconductor package, semiconductor assembly and method for fabric...

Semiconductor device including a bidirectional switch

Semiconductor package having a laser-activatable mold compound

Semiconductor device including a bidirectional switch

Semiconductor device with bond pad extensions formed on molded appe...

Method of producing an SMD package with top side cooling

Device including a semiconductor chip monolithically integrated wit...

Multi-package top-side-cooling

SMD package with flat contacts to prevent bottleneck

Device including a compound semiconductor chip

SMD package with top side cooling

Method of manufacturing a semiconductor device

Electronic component

Semiconductor chip package having a repeating footprint pattern

Connection structure and electronic component

Interdigit device on leadframe for evenly distributed current flow

Semiconductor chip package having contact pins at short side edges

Semiconductor component having inner and outer semiconductor compon...

Package and a method of manufacturing the same

Compound semiconductor device including a sensing lead

Electronic component and switch circuit

Top side cooling for GaN power device

Chip carrier structure, chip package and method of manufacturing th...

Semiconductor package with top side cooling heat sink thermal pathway

Lateral element isolation device

Compound semiconductor device including a multilevel carrier

Semiconductor devices including control and load leads of opposite...

Device including multiple semiconductor chips and multiple carriers

Method of manufacturing an electronic component

Patents Applicationslast 30 patents

PACKAGE FOR A LATERAL POWER TRANSISTOR

Semiconductor Device Including a Bidirectional Switch

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING A SEMICONDUCTOR P...

Semiconductor Device Including a Bidirectional Switch

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR ASSEMBLY AND METHOD FOR FABRIC...

Semiconductor Package Having a Laser-Activatable Mold Compound

Semiconductor Device with Bond Pad Extensions Formed on Molded Appe...

Method of Producing an SMD Package with Top Side Cooling

Multi-Package Top-Side-Cooling

SMD Package with Top Side Cooling

SMD Package

Device Including a Compound Semiconductor Chip

INTERDIGIT DEVICE ON LEADFRAME FOR EVENLY DISTRIBUTED CURRENT FLOW

Leadframe and method of manufacturing the same

Semiconductor Device Including a Bidirectional Switch

Semiconductor Chip Package Having a Repeating Footprint Pattern

Device Including a Semiconductor Chip Monolithically Integrated wit...

Redirecting solder material to visually inspectable package surface

Electronic Component and Switch Circuit

Method of Manufacturing an Electronic Component

Compound Semiconductor Device Including a Sensing Lead

SEMICONDUCTOR DEVICES INCLUDING CONTROL AND LOAD LEADS OF OPPOSITE...

Compound Semiconductor Device Including a Multilevel Carrier

Semiconductor Chip Package Having Contact Pins at Short Side Edges

Heat Spreader, Electronic Module Comprising a Heat Spreader and Met...

Semiconductor Component Having Inner and Outer Semiconductor Compon...

Electronic Component

Electronic Component

Electronic Component

METHOD FOR MANUFACTURING A CHIP ARRANGEMENT