Scott D. Marshall

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Power amplifier packages and systems incorporating design-flexible...
- Patent number 11,621,673
- Issue date Apr 4, 2023
- NXP USA, INC.
- Jean-Christophe Nanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond wire array for packaged semiconductor device
- Patent number 11,049,837
- Issue date Jun 29, 2021
- NXP USA, INC.
- Jitesh Vaswani
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
High power semiconductor package subsystems
- Patent number 10,211,177
- Issue date Feb 19, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with impedance matching-circuits
- Patent number 9,748,185
- Issue date Aug 29, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package subsystems
- Patent number 9,673,162
- Issue date Jun 6, 2017
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with impedance matching-circuits
- Patent number 9,281,283
- Issue date Mar 8, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High impedance radio frequency power plastic package
- Patent number 6,982,483
- Issue date Jan 3, 2006
- FREESCALE SEMICONDUCTOR, INC.
- Robert J. McLaughlin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BOND WIRE ARRAY FOR PACKAGED SEMICONDUCTOR DEVICE
- Publication number 20210035942
- Publication date Feb 4, 2021
- NXP USA, Inc.
- Jitesh VASWANI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE...
- Publication number 20200328721
- Publication date Oct 15, 2020
- NXP USA, Inc.
- Jean-Christophe Nanan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS
- Publication number 20170271292
- Publication date Sep 21, 2017
- NXP USA, Inc.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS
- Publication number 20160172318
- Publication date Jun 16, 2016
- FREESCALE SEMICONDUCTOR, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS
- Publication number 20140070397
- Publication date Mar 13, 2014
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS, AND METHODS...
- Publication number 20140070365
- Publication date Mar 13, 2014
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High impedance radio frequency power plastic package
- Publication number 20040241913
- Publication date Dec 2, 2004
- MOTOROLA, INC.
- Robert J. Mclaughlin
- H01 - BASIC ELECTRIC ELEMENTS

Scott D. Marshall

Person

Patents Grantslast 30 patents

Power amplifier packages and systems incorporating design-flexible...

Bond wire array for packaged semiconductor device

High power semiconductor package subsystems

Semiconductor devices with impedance matching-circuits

High power semiconductor package subsystems

Semiconductor devices with impedance matching-circuits

High impedance radio frequency power plastic package

Patents Applicationslast 30 patents

BOND WIRE ARRAY FOR PACKAGED SEMICONDUCTOR DEVICE

POWER AMPLIFIER PACKAGES AND SYSTEMS INCORPORATING DESIGN-FLEXIBLE...

HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS

SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS

HIGH POWER SEMICONDUCTOR PACKAGE SUBSYSTEMS

SEMICONDUCTOR DEVICES WITH IMPEDANCE MATCHING-CIRCUITS, AND METHODS...

High impedance radio frequency power plastic package