Scott I. Langenthal

Person

Hyde Park, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,984,792
- Issue date Jan 10, 2006
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric interposer for chip to substrate soldering
- Patent number 6,657,313
- Issue date Dec 2, 2003
- International Business Machines Corporation
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,559,527
- Issue date May 6, 2003
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Self-scrub buckling beam probe
- Patent number 6,529,021
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Yuet-Ying Yu
- G01 - MEASURING TESTING
Information Patent Grant
Surface metallization structure for multiple chip test and burn-in
- Patent number 6,376,054
- Issue date Apr 23, 2002
- International Business Machines Corporation
- Scott I. Langenthal
- G01 - MEASURING TESTING
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,312,791
- Issue date Nov 6, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and materials for increasing the strength of crystalline cer...
- Patent number 6,258,191
- Issue date Jul 10, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling a chip carrier to a semiconductor device
- Patent number 6,220,499
- Issue date Apr 24, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer ceramic substrate with anchored pad
- Patent number 6,187,418
- Issue date Feb 13, 2001
- International Business Machines Corporation
- Benjamin V. Fasano
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming cone shaped solder for chip interconnection
- Patent number 6,184,062
- Issue date Feb 6, 2001
- International Business Machines Corporation
- Peter Jeffrey Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing ceramic surfaces with easily removable contact...
- Patent number 6,139,666
- Issue date Oct 31, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Ceramic substrate having a sealed layer
- Patent number 6,136,419
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Benjamin V. Fasano
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
Dielectric interposer for chip to substrate soldering
- Publication number 20030193093
- Publication date Oct 16, 2003
- International Business Machines Corporation
- Peter J. Brofman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Process for forming cone shaped solder for chip interconnection
- Publication number 20010015495
- Publication date Aug 23, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Scott I. Langenthal

Person

Patents Grantslast 30 patents

Dielectric interposer for chip to substrate soldering

Dielectric interposer for chip to substrate soldering

Process for forming cone shaped solder for chip interconnection

Self-scrub buckling beam probe

Surface metallization structure for multiple chip test and burn-in

Multilayer ceramic substrate with anchored pad

Method and materials for increasing the strength of crystalline cer...

Method for assembling a chip carrier to a semiconductor device

Multilayer ceramic substrate with anchored pad

Process for forming cone shaped solder for chip interconnection

Method for producing ceramic surfaces with easily removable contact...

Ceramic substrate having a sealed layer

Patents Applicationslast 30 patents

Dielectric interposer for chip to substrate soldering

Process for forming cone shaped solder for chip interconnection