Scott J. Campbell

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Sunnyvale, CA, US

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Patents Applicationslast 30 patents

Information Patent Application
COMPRESSION STRUCTURES FOR IC PACKAGES
- Publication number 20240105639
- Publication date Mar 28, 2024
- Apple Inc.
- Helia Rahmani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-CAPACITY COMPUTER MODULES
- Publication number 20200383206
- Publication date Dec 3, 2020
- Apple Inc.
- Brett W. Degner
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR