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Scott K. Pozder
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Saratoga Springs, NY, US
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Patents Grants
last 30 patents
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Patent Grant
Chip package interaction (CPI) back-end-of-line (BEOL) monitoring s...
Patent number
10,643,912
Issue date
May 5, 2020
GLOBALFOUNDRIES Inc.
Scott K. Pozder
G01 - MEASURING TESTING
Information
Patent Grant
Bond pads with surrounding fill lines
Patent number
10,566,300
Issue date
Feb 18, 2020
GLOBALFOUNDRIES Inc.
Scott Pozder
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
LASER CHIPS WITH A LEAD FRAME ATTACHMENT TO A PHOTONICS CHIP
Publication number
20240413603
Publication date
Dec 12, 2024
GLOBALFOUNDRIES U.S. Inc.
Scott Pozder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
BOND PADS WITH SURROUNDING FILL LINES
Publication number
20190229079
Publication date
Jul 25, 2019
GLOBALFOUNDRIES INC.
Scott Pozder
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE INTERACTION (CPI) BACK-END-OF-LINE (BEOL) MONITORING S...
Publication number
20190027413
Publication date
Jan 24, 2019
GLOBALFOUNDRIES INC.
Scott K. Pozder
H01 - BASIC ELECTRIC ELEMENTS