Scott Kirkman

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with traces routed underneath a die
- Patent number 6,137,168
- Issue date Oct 24, 2000
- LSI Logic Corporation
- Scott Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package including a substrate having bonding f...
- Patent number 6,064,113
- Issue date May 16, 2000
- LSI Logic Corporation
- Scott L. Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making electrical interconnections between layers of an...
- Patent number 5,992,012
- Issue date Nov 30, 1999
- LSI Logic Corporation
- Scott Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming electrical connections between a semiconductor d...
- Patent number 5,911,112
- Issue date Jun 8, 1999
- LSI Logic Corporation
- Scott Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having capacitive extension spokes and method...
- Patent number 5,903,050
- Issue date May 11, 1999
- LSI Logic Corporation
- Aritharan Thurairajaratnam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for forming electrical connections between a semiconducto...
- Patent number 5,793,104
- Issue date Aug 11, 1998
- LSI Logic Corporation
- Scott Kirkman
- H01 - BASIC ELECTRIC ELEMENTS