Scott L. Kirkman

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Menlo Park, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Deep trench capacitors embedded in package substrate
- Patent number 11,784,215
- Issue date Oct 10, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density ball grid array (BGA) package capacitor design
- Patent number 10,892,316
- Issue date Jan 12, 2021
- Google LLC
- Scott Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal heat spreader
- Patent number 7,007,741
- Issue date Mar 7, 2006
- Sun Microsystems, Inc.
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
- Publication number 20230420494
- Publication date Dec 28, 2023
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS EMBEDDED IN PACKAGE SUBSTRATE
- Publication number 20210273042
- Publication date Sep 2, 2021
- Google LLC
- Nam Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY BALL GRID ARRAY (BGA) PACKAGE CAPACITOR DESIGN
- Publication number 20200161413
- Publication date May 21, 2020
- Google LLC
- Scott Kirkman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal expansion compensation graded IC package
- Publication number 20070080441
- Publication date Apr 12, 2007
- Scott Kirkman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conformal heat spreader
- Publication number 20040074630
- Publication date Apr 22, 2004
- Bidyut K. Sen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dynamic solder attach
- Publication number 20030170972
- Publication date Sep 11, 2003
- Scott L. Kirkman
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...