Scott M. Hayes

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 12,125,716
- Issue date Oct 22, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned and planarized under-bump metallization
- Patent number 12,119,316
- Issue date Oct 15, 2024
- NXP USA, INC.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with self-aligned waveguide and method therefor
- Patent number 12,033,950
- Issue date Jul 9, 2024
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with connector in package and method therefor
- Patent number 11,961,776
- Issue date Apr 16, 2024
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated EF/EMI shi...
- Patent number 11,935,809
- Issue date Mar 19, 2024
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with waveguide and method therefor
- Patent number 11,837,560
- Issue date Dec 5, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having stress isolation and method the...
- Patent number 11,823,968
- Issue date Nov 21, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermal dissipation feature and...
- Patent number 11,817,366
- Issue date Nov 14, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,791,283
- Issue date Oct 17, 2023
- NXP USA, INC.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,760,623
- Issue date Sep 19, 2023
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,728,285
- Issue date Aug 15, 2023
- NXP USA, INC.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a translation feature and method therefor
- Patent number 11,557,544
- Issue date Jan 17, 2023
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package thermal spreader having integrated RF/EMI shi...
- Patent number 11,557,525
- Issue date Jan 17, 2023
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-gel pressure sensor package
- Patent number 11,498,829
- Issue date Nov 15, 2022
- NXP USA, INC.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor device packaging warpage control
- Patent number 11,404,288
- Issue date Aug 2, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system, and apparatus for forming three-dimensional semicon...
- Patent number 11,335,652
- Issue date May 17, 2022
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with waveguide and method therefor
- Patent number 11,133,273
- Issue date Sep 28, 2021
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package integrated waveguide
- Patent number 11,031,681
- Issue date Jun 8, 2021
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated opening with vent path
- Patent number 10,834,817
- Issue date Nov 10, 2020
- NXP USA, INC.
- Michael B. Vincent
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package integrated waveguide
- Patent number 10,651,541
- Issue date May 12, 2020
- NXP USA, INC.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices with multi-layer package surface conductors...
- Patent number 10,388,607
- Issue date Aug 20, 2019
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power semiconductor package subsystems
- Patent number 10,211,177
- Issue date Feb 19, 2019
- NXP USA, INC.
- Lakshminarayan Viswanathan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged devices with multiple planes of embedded electronic devices
- Patent number 10,163,874
- Issue date Dec 25, 2018
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plated opening with vent path
- Patent number 10,143,084
- Issue date Nov 27, 2018
- NXP USA, INC.
- Michael B. Vincent
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
EMI/RFI shielding for semiconductor device packages
- Patent number 10,074,614
- Issue date Sep 11, 2018
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optically-masked microelectronic packages and methods for the fabri...
- Patent number 9,997,492
- Issue date Jun 12, 2018
- NXP USA, INC.
- Weng F. Yap
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices and stacked microelectronic packages with package surface c...
- Patent number 9,960,149
- Issue date May 1, 2018
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged devices with multiple planes of embedded electronic devices
- Patent number 9,799,636
- Issue date Oct 24, 2017
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic packages having embedded sidewall substrates and me...
- Patent number 9,761,565
- Issue date Sep 12, 2017
- NXP USA, INC.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI/RFI shielding for semiconductor device packages
- Patent number 9,673,150
- Issue date Jun 6, 2017
- NXP USA, INC.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20250006511
- Publication date Jan 2, 2025
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT
- Publication number 20240425367
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT
- Publication number 20240425364
- Publication date Dec 26, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240379474
- Publication date Nov 14, 2024
- NXP USA, Inc.
- Ankur Shailesh Shah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE
- Publication number 20240332105
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR
- Publication number 20240332206
- Publication date Oct 3, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MULTICHIP PACKAGES
- Publication number 20240186301
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP PACKAGES WITH 3D INTEGRATION
- Publication number 20240186303
- Publication date Jun 6, 2024
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR
- Publication number 20240178111
- Publication date May 30, 2024
- NXP USA, Inc.
- Chayathorn Saklang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR
- Publication number 20240105660
- Publication date Mar 28, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
- Publication number 20240088068
- Publication date Mar 14, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR
- Publication number 20230402408
- Publication date Dec 14, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION
- Publication number 20230378106
- Publication date Nov 23, 2023
- NXP USA, Inc.
- Namrata Kanth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230369248
- Publication date Nov 16, 2023
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20230268304
- Publication date Aug 24, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR
- Publication number 20230178508
- Publication date Jun 8, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONNECTOR IN PACKAGE AND METHOD THEREFOR
- Publication number 20230170270
- Publication date Jun 1, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...
- Publication number 20230106555
- Publication date Apr 6, 2023
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20230066652
- Publication date Mar 2, 2023
- NXP USA, Inc.
- Vivek Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20230059566
- Publication date Feb 23, 2023
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR
- Publication number 20230017646
- Publication date Jan 19, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20220392777
- Publication date Dec 8, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...
- Publication number 20220384299
- Publication date Dec 1, 2022
- NXP USA, Inc.
- Zhiwei Gong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220344235
- Publication date Oct 27, 2022
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL
- Publication number 20220336371
- Publication date Oct 20, 2022
- NXP USA, Inc.
- Scott M. Hayes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...
- Publication number 20220181230
- Publication date Jun 9, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A TRANSLATION FEATURE AND METHOD THEREFOR
- Publication number 20220068828
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...
- Publication number 20220068738
- Publication date Mar 3, 2022
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH WAVEGUIDE AND METHOD THEREFOR
- Publication number 20210391285
- Publication date Dec 16, 2021
- NXP USA, Inc.
- MICHAEL B. VINCENT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-GEL PRESSURE SENSOR PACKAGE
- Publication number 20210221671
- Publication date Jul 22, 2021
- NXP USA, Inc.
- Stephen Ryan Hooper
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Scott M. Hayes

Person

Patents Grantslast 30 patents

Semiconductor device packaging warpage control

Patterned and planarized under-bump metallization

Semiconductor device with self-aligned waveguide and method therefor

Semiconductor device with connector in package and method therefor

Semiconductor package thermal spreader having integrated EF/EMI shi...

Semiconductor device with waveguide and method therefor

Semiconductor device package having stress isolation and method the...

Semiconductor device package having thermal dissipation feature and...

Semiconductor device packaging warpage control

No-gel pressure sensor package

Semiconductor device packaging warpage control

Semiconductor device having a translation feature and method therefor

Semiconductor package thermal spreader having integrated RF/EMI shi...

No-gel pressure sensor package

Semiconductor device packaging warpage control

Method, system, and apparatus for forming three-dimensional semicon...

Semiconductor device with waveguide and method therefor

Package integrated waveguide

Plated opening with vent path

Package integrated waveguide

Microelectronic devices with multi-layer package surface conductors...

High power semiconductor package subsystems

Packaged devices with multiple planes of embedded electronic devices

Plated opening with vent path

EMI/RFI shielding for semiconductor device packages

Optically-masked microelectronic packages and methods for the fabri...

Devices and stacked microelectronic packages with package surface c...

Packaged devices with multiple planes of embedded electronic devices

Microelectronic packages having embedded sidewall substrates and me...

EMI/RFI shielding for semiconductor device packages

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT

DIE STACKING WITH CONTROLLED TILT AND ANGULAR ALIGNMENT

A PACKAGED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

MULTIDEVICE PACKAGE WITH RECESSED MOUNTING SURFACE

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR

DOUBLE-SIDED MULTICHIP PACKAGES

MULTICHIP PACKAGES WITH 3D INTEGRATION

SEMICONDUCTOR DEVICE WITH ATTACHED BATTERY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH ACTIVE MOLD PACKAGE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH ENCLOSED CAVITY AND METHOD THEREFOR

PATTERNED AND PLANARIZED UNDER-BUMP METALLIZATION

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH OPEN CAVITY AND METHOD THEREFOR

SEMICONDUCTOR DEVICE WITH CONNECTOR IN PACKAGE AND METHOD THEREFOR

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED EF/EMI SHI...

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

NO-GEL PRESSURE SENSOR PACKAGE

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR PACKAGE THERMAL SPREADER HAVING INTEGRATED RF/EMI SHI...

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...

SEMICONDUCTOR DEVICE PACKAGING WARPAGE CONTROL

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND...

SEMICONDUCTOR DEVICE HAVING A TRANSLATION FEATURE AND METHOD THEREFOR

SEMICONDUCTOR DEVICE PACKAGE HAVING STRESS ISOLATION AND METHOD THE...

SEMICONDUCTOR DEVICE WITH WAVEGUIDE AND METHOD THEREFOR

NO-GEL PRESSURE SENSOR PACKAGE