Scott M. MOKLER

Person

Hillsboro, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hybrid microelectronic substrates
- Patent number 11,923,257
- Issue date Mar 5, 2024
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 11,444,033
- Issue date Sep 13, 2022
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrates
- Patent number 11,114,353
- Issue date Sep 7, 2021
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 10,763,215
- Issue date Sep 1, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid microelectronic substrate and methods for fabricating the same
- Patent number 10,716,214
- Issue date Jul 14, 2020
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding in electronic assemblies
- Patent number 10,548,249
- Issue date Jan 28, 2020
- Intel Corporation
- Scott Mokler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Development of the advanced component in cavity technology
- Patent number 10,159,152
- Issue date Dec 18, 2018
- Intel Corporation
- Ladd D. Campbell
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HV TRANSISTORS & RESISTORS FOR STACKED TRANSISTOR ARCHITECTURES
- Publication number 20250221017
- Publication date Jul 3, 2025
- Intel Corporation
- Rahul Ramaswamy
Information Patent Application
TRANSISTOR PERFORMANCE IMPROVEMENT FOR STACKED DEVICES USING SELECT...
- Publication number 20250210460
- Publication date Jun 26, 2025
- Intel Corporation
- Rahul Ramaswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TRANSISTORS WITH STRAIN MATERIALS ON SOURCE AND DRAIN
- Publication number 20250113561
- Publication date Apr 3, 2025
- Intel Corporation
- Rahul Ramaswamy
Information Patent Application
GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIAL N...
- Publication number 20250089312
- Publication date Mar 13, 2025
- Intel Corporation
- Rahul RAMASWAMY
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATES
- Publication number 20210384094
- Publication date Dec 9, 2021
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME
- Publication number 20200335444
- Publication date Oct 22, 2020
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE AND MULTILEVEL SOLDER PASTE PIN TRANSFER
- Publication number 20190221456
- Publication date Jul 18, 2019
- Intel Corporation
- Dudi AMIR
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHIELDING IN ELECTRONIC ASSEMBLIES
- Publication number 20190098802
- Publication date Mar 28, 2019
- Intel Corporation
- Scott Mokler
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME
- Publication number 20190057937
- Publication date Feb 21, 2019
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID MICROELECTRONIC SUBSTRATES
- Publication number 20190057915
- Publication date Feb 21, 2019
- Intel Corporation
- Robert Starkston
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE...
- Publication number 20180343744
- Publication date Nov 29, 2018
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVELOPMENT OF THE ADVANCED COMPONENT IN CAVITY TECHNOLOGY
- Publication number 20170181286
- Publication date Jun 22, 2017
- Intel Corporation
- Ladd D. CAMPBELL
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Scott M. MOKLER

Person

Patents Grantslast 30 patents

Hybrid microelectronic substrates

Hybrid microelectronic substrate and methods for fabricating the same

Hybrid microelectronic substrates

Hybrid microelectronic substrate and methods for fabricating the same

Hybrid microelectronic substrate and methods for fabricating the same

Shielding in electronic assemblies

Development of the advanced component in cavity technology

Patents Applicationslast 30 patents

HV TRANSISTORS & RESISTORS FOR STACKED TRANSISTOR ARCHITECTURES

TRANSISTOR PERFORMANCE IMPROVEMENT FOR STACKED DEVICES USING SELECT...

STACKED TRANSISTORS WITH STRAIN MATERIALS ON SOURCE AND DRAIN

GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING DIFFERENTIAL N...

HYBRID MICROELECTRONIC SUBSTRATES

HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME

SELECTIVE AND MULTILEVEL SOLDER PASTE PIN TRANSFER

SHIELDING IN ELECTRONIC ASSEMBLIES

HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE SAME

HYBRID MICROELECTRONIC SUBSTRATES

A HYBRID MICROELECTRONIC SUBSTRATE AND METHODS FOR FABRICATING THE...

DEVELOPMENT OF THE ADVANCED COMPONENT IN CAVITY TECHNOLOGY