Scott MacDonald

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Medford, MA, US

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Patents Grantslast 30 patents

Information Patent Grant
Method for packaging semiconductors at wafer level
- Patent number 8,178,391
- Issue date May 15, 2012
- Raytheon Company
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging semiconductors at wafer level
- Patent number 8,035,219
- Issue date Oct 11, 2011
- Raytheon Company
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT WAFER LEVEL
- Publication number 20120009735
- Publication date Jan 12, 2012
- Raytheon Company
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING SEMICONDUCTORS AT A WAFER LEVEL
- Publication number 20100013088
- Publication date Jan 21, 2010
- William J. Davis
- H01 - BASIC ELECTRIC ELEMENTS