Scott R. Sayles

Person

Mead, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sputter trap having a thin high purity coating layer and method of...
- Patent number 11,981,991
- Issue date May 14, 2024
- Honeywell International Inc.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter trap having a thin high purity coating layer and method of...
- Patent number 11,584,985
- Issue date Feb 21, 2023
- Honeywell International Inc.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sputter trap having multimodal particle size distribution
- Patent number 10,968,510
- Issue date Apr 6, 2021
- Honeywell International Inc.
- Jaeyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputter trap having multimodal particle size distribution
- Patent number 10,655,212
- Issue date May 19, 2020
- Honeywell Internatonal Inc
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Target assemblies, targets, backing plates, and methods of target c...
- Patent number 7,691,240
- Issue date Apr 6, 2010
- Honeywell International Inc.
- Werner H. Hort
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SPUTTER TRAP HAVING A THIN HIGH PURITY COATING LAYER AND METHOD OF...
- Publication number 20230143320
- Publication date May 11, 2023
- Honeywell International Inc.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTER TRAP HAVING MULTIMODAL PARTICLE SIZE DISTRIBUTION
- Publication number 20200240004
- Publication date Jul 30, 2020
- HONEYWELL INTERNATIONAL INC.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTER TRAP HAVING A THIN HIGH PURITY COATING LAYER AND METHOD OF...
- Publication number 20200048761
- Publication date Feb 13, 2020
- HONEYWELL INTERNATIONAL INC.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTER TRAP HAVING MULTIMODAL PARTICLE SIZE DISTRIBUTION
- Publication number 20180171465
- Publication date Jun 21, 2018
- HONEYWELL INTERNATIONAL INC.
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING DEVICE COMPONENT WITH MODIFIED SURFACE AND METHOD OF MAKING
- Publication number 20170229295
- Publication date Aug 10, 2017
- HONEYWELL INTERNATIONAL INC.
- Jaeyeon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of treating deposition process components to form particle...
- Publication number 20070056688
- Publication date Mar 15, 2007
- Jaeyeon Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Target assemblies, targets, backing plates, and methods of target c...
- Publication number 20060260936
- Publication date Nov 23, 2006
- Werner H. Hort
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Scott R. Sayles

Person

Patents Grantslast 30 patents

Sputter trap having a thin high purity coating layer and method of...

Sputter trap having a thin high purity coating layer and method of...

Sputter trap having multimodal particle size distribution

Sputter trap having multimodal particle size distribution

Target assemblies, targets, backing plates, and methods of target c...

Patents Applicationslast 30 patents

SPUTTER TRAP HAVING A THIN HIGH PURITY COATING LAYER AND METHOD OF...

SPUTTER TRAP HAVING MULTIMODAL PARTICLE SIZE DISTRIBUTION

SPUTTER TRAP HAVING A THIN HIGH PURITY COATING LAYER AND METHOD OF...

SPUTTER TRAP HAVING MULTIMODAL PARTICLE SIZE DISTRIBUTION

SPUTTERING DEVICE COMPONENT WITH MODIFIED SURFACE AND METHOD OF MAKING

Methods of treating deposition process components to form particle...

Target assemblies, targets, backing plates, and methods of target c...