Scott Vilander

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Santa Barbara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Wafer level packaging of microbolometer vacuum package assemblies
- Patent number 9,741,591
- Issue date Aug 22, 2017
- FLIR Systems, Inc.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
- Publication number 20170372920
- Publication date Dec 28, 2017
- FLIR SYSTEMS, INC.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
WAFER LEVEL PACKAGING OF MICROBOLOMETER VACUUM PACKAGE ASSEMBLIES
- Publication number 20140186999
- Publication date Jul 3, 2014
- FLIR SYSTEMS, INC.
- Paul Schweikert
- B81 - MICRO-STRUCTURAL TECHNOLOGY