Scott W. Huffer

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Crown Point, IN, US

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Patents Grantslast 30 patents

Information Patent Grant
Thermoformable conductive laminate and process
- Patent number 6,001,207
- Issue date Dec 14, 1999
- Avery Dennison Corporation
- Howard H. Enlow
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoformable conductive laminate and process
- Patent number 5,686,186
- Issue date Nov 11, 1997
- Avery Dennison Corporation
- Howard H. Enlow
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermoformable conductive laminate and process
- Patent number 5,490,893
- Issue date Feb 13, 1996
- Avery Dennison Corporation
- Howard H. Enlow
- B32 - LAYERED PRODUCTS