Scott WALLACE

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Dresden, DE

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Patents Grantslast 30 patents

Information Patent Grant
Method of processing a semiconductor wafer
- Patent number 9,401,343
- Issue date Jul 26, 2016
- Infineon Technologies AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device bond pads over process control monitor structures in a semic...
- Patent number 8,994,148
- Issue date Mar 31, 2015
- Infineon Technologies AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure having metal oxide or nirtride passivation...
- Patent number 8,872,341
- Issue date Oct 28, 2014
- Infineon Technologies AG
- Gerald Dallmann
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER SEMICONDUCTOR DEVICE WITH SOLDERABLE POWER PAD
- Publication number 20240194580
- Publication date Jun 13, 2024
- INFINEON TECHNOLOGIES AG
- Susanne Schulte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PROCESSING A SEMICONDUCTOR WAFER
- Publication number 20150179606
- Publication date Jun 25, 2015
- INFINEON TECHNOLOGIES AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device Bond Pads Over Process Control Monitor Structures in a Semic...
- Publication number 20140232001
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Achim Gratz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING SAME
- Publication number 20120074573
- Publication date Mar 29, 2012
- Gerald DALLMANN
- H01 - BASIC ELECTRIC ELEMENTS