Scott Wu

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package assembly including a semiconductor substrate in which a fir...
- Patent number 9,768,144
- Issue date Sep 19, 2017
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for improving the reliability of a connection...
- Patent number 9,659,851
- Issue date May 23, 2017
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed semiconductor substrates and associated techniques
- Patent number 9,391,045
- Issue date Jul 12, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package assembly including a semiconductor substrate in which a fir...
- Patent number 9,257,410
- Issue date Feb 9, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures embedded within core material and methods of manufacturi...
- Patent number 9,087,835
- Issue date Jul 21, 2015
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a semiconductor die embedded within subs...
- Patent number 9,070,679
- Issue date Jun 30, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed semiconductor substrates and associated techniques
- Patent number 9,034,730
- Issue date May 19, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures embedded within core material and methods of manufacturi...
- Patent number 8,618,654
- Issue date Dec 31, 2013
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die with protective interposer
- Patent number 8,338,934
- Issue date Dec 25, 2012
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE IN WHICH A FIR...
- Publication number 20160155732
- Publication date Jun 2, 2016
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR DIE EMBEDDED WITHIN SUBS...
- Publication number 20150311147
- Publication date Oct 29, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES
- Publication number 20150279806
- Publication date Oct 1, 2015
- Marvell World Trade Ltd.
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR IMPROVING THE RELIABILITY OF A CONNECTION...
- Publication number 20150228569
- Publication date Aug 13, 2015
- Marvell World Trade Ltd.
- Long-Ching Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20140124961
- Publication date May 8, 2014
- Marvell World Trade Ltd.
- Albert WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES EMBEDDED WITHIN CORE MATERIAL AND METHODS OF MANUFACTURI...
- Publication number 20140106508
- Publication date Apr 17, 2014
- Marvell World Trade Ltd.
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMEBEDDED STRUCTURES AND METHODS OF MANUFACTURE THEREOF
- Publication number 20120049364
- Publication date Mar 1, 2012
- Sehat Sutardja
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE WITH PROTECTIVE INTERPOSER
- Publication number 20110227223
- Publication date Sep 22, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20110186960
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES
- Publication number 20110186992
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSED SEMICONDUCTOR SUBSTRATES
- Publication number 20110186998
- Publication date Aug 4, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED CHIP PACKAGES
- Publication number 20110121444
- Publication date May 26, 2011
- Albert Wu
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Package assembly including a semiconductor substrate in which a fir...

Method and apparatus for improving the reliability of a connection...

Recessed semiconductor substrates and associated techniques

Package assembly including a semiconductor substrate in which a fir...

Structures embedded within core material and methods of manufacturi...

Semiconductor package with a semiconductor die embedded within subs...

Recessed semiconductor substrates and associated techniques

Structures embedded within core material and methods of manufacturi...

Embedded die with protective interposer

Patents Applicationslast 30 patents

PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE IN WHICH A FIR...

SEMICONDUCTOR PACKAGE WITH A SEMICONDUCTOR DIE EMBEDDED WITHIN SUBS...

RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES

METHOD AND APPARATUS FOR IMPROVING THE RELIABILITY OF A CONNECTION...

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

STRUCTURES EMBEDDED WITHIN CORE MATERIAL AND METHODS OF MANUFACTURI...

EMEBEDDED STRUCTURES AND METHODS OF MANUFACTURE THEREOF

EMBEDDED DIE WITH PROTECTIVE INTERPOSER

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

RECESSED SEMICONDUCTOR SUBSTRATES AND ASSOCIATED TECHNIQUES

RECESSED SEMICONDUCTOR SUBSTRATES

EMBEDDED CHIP PACKAGES