Se-Ho YOU

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 12,261,135
- Issue date Mar 25, 2025
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,855,013
- Issue date Dec 26, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including antenna pattern
- Patent number 11,626,373
- Issue date Apr 11, 2023
- Samsung Electronics Co., Ltd.
- Se Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,482,509
- Issue date Oct 25, 2022
- Samsung Electronics Co., Ltd.
- Se-Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 11,380,635
- Issue date Jul 5, 2022
- Samsung Electronics Co., Ltd.
- Se-Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates
- Patent number 10,256,181
- Issue date Apr 9, 2019
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrates
- Patent number 10,032,706
- Issue date Jul 24, 2018
- Samsung Electronics Co., Ltd.
- JinGyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked package structure and method of forming a package-on-packag...
- Patent number 9,520,387
- Issue date Dec 13, 2016
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack type semiconductor package
- Patent number 9,171,827
- Issue date Oct 27, 2015
- Samsung Electronics Co., Ltd.
- Jin-Ho Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package
- Patent number 9,147,643
- Issue date Sep 29, 2015
- Samsung Electronics Co., Ltd.
- SE-Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package having the same
- Patent number 9,030,838
- Issue date May 12, 2015
- Samsung Electronics Co., Ltd.
- Se-Ho You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power compensation device and light emitting diode illumination app...
- Patent number 8,928,247
- Issue date Jan 6, 2015
- LG Electronics Inc.
- Jeong In Cheon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked package structure including insulating layer between two st...
- Patent number 8,872,319
- Issue date Oct 28, 2014
- Samsung Electronics Co., Ltd.
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and semiconductor package having the same
- Patent number 8,649,186
- Issue date Feb 11, 2014
- Samsung Electronics Co., Ltd.
- Se-Ho You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and methods of manufacturing the same
- Patent number 8,084,359
- Issue date Dec 27, 2011
- Samsung Electronics Co., Ltd.
- Se-Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Display apparatus and flexible substrate
- Patent number 7,414,851
- Issue date Aug 19, 2008
- LG Electronics Inc.
- Se Joon You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230260887
- Publication date Aug 17, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN
- Publication number 20230215824
- Publication date Jul 6, 2023
- Samsung Electronics Co., Ltd.
- Se Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20230133977
- Publication date May 4, 2023
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20220302052
- Publication date Sep 22, 2022
- Samsung Electronics Co., Ltd.
- SE-HO YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN
- Publication number 20210398924
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Se Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20210335734
- Publication date Oct 28, 2021
- Samsung Electronics Co., Ltd.
- SE-HO YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210167040
- Publication date Jun 3, 2021
- Samsung Electronics Co., Ltd.
- SE-HO YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20180315698
- Publication date Nov 1, 2018
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATES
- Publication number 20170077041
- Publication date Mar 16, 2017
- Samsung Electronics Co., Ltd.
- JinGyu KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING A PACKAGE-ON-...
- Publication number 20150024545
- Publication date Jan 22, 2015
- Samsung Electronics Co., Ltd.
- Yong-Hoon KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20140319662
- Publication date Oct 30, 2014
- SE-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK TYPE SEMICONDUCTOR PACKAGE
- Publication number 20140291868
- Publication date Oct 2, 2014
- JIN-HO LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20140140026
- Publication date May 22, 2014
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER COMPENSATION DEVICE AND LIGHT EMITTING DIODE ILLUMINATION APP...
- Publication number 20130257298
- Publication date Oct 3, 2013
- JEONG IN CHEON
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED PACKAGE STRUCTURE
- Publication number 20120139090
- Publication date Jun 7, 2012
- Yong-Hoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
- Publication number 20110141712
- Publication date Jun 16, 2011
- Se-Ho You
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor package and methods of manufacturing the same
- Publication number 20100167423
- Publication date Jul 1, 2010
- Se-Ho You
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
- Publication number 20080099885
- Publication date May 1, 2008
- Samsung Electronics Co., Ltd.
- Se-Ho YOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Display apparatus and flexible substrate
- Publication number 20060198106
- Publication date Sep 7, 2006
- LG ELECTRONICS INC.
- Se Joon You
- G02 - OPTICS
Information Patent Application
FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING...
- Publication number 20060198054
- Publication date Sep 7, 2006
- LG ELECTRONICS INC.
- Se Joon You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Plasma display apparatus including heat sink assembly apparatus
- Publication number 20060050481
- Publication date Mar 9, 2006
- LG ELECTRONICS INC.
- Se Joon You
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Person

Patents Grantslast 30 patents

Semiconductor packages including antenna pattern

Semiconductor device

Semiconductor packages including antenna pattern

Semiconductor package

Semiconductor device

Package substrates

Package substrates

Stacked package structure and method of forming a package-on-packag...

Stack type semiconductor package

Semiconductor package

Package substrate and semiconductor package having the same

Power compensation device and light emitting diode illumination app...

Stacked package structure including insulating layer between two st...

Package substrate and semiconductor package having the same

Semiconductor package and methods of manufacturing the same

Display apparatus and flexible substrate

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGES INCLUDING ANTENNA PATTERN

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATES

PACKAGE SUBSTRATES

STACKED PACKAGE STRUCTURE AND METHOD OF MANUFACTURING A PACKAGE-ON-...

SEMICONDUCTOR PACKAGE

STACK TYPE SEMICONDUCTOR PACKAGE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

POWER COMPENSATION DEVICE AND LIGHT EMITTING DIODE ILLUMINATION APP...

STACKED PACKAGE STRUCTURE

PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor package and methods of manufacturing the same

SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME

Display apparatus and flexible substrate

FLEXIBLE TYPE UNIT, FLEXIBLE TYPE REEL, AND METHOD OF MANUFACTURING...

Plasma display apparatus including heat sink assembly apparatus