Se Hwan Hong

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 12,002,725
- Issue date Jun 4, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,961,775
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,682,598
- Issue date Jun 20, 2023
- Amkor Technology Singapore Holding Pte.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,495,505
- Issue date Nov 8, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and related methods
- Patent number 11,398,455
- Issue date Jul 26, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 11,177,187
- Issue date Nov 16, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Sensor package and manufacturing method thereof
- Patent number 10,672,676
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,984,947
- Issue date May 29, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensor and manufacturing method thereof
- Patent number 9,728,476
- Issue date Aug 8, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321658
- Publication date Sep 26, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20240258182
- Publication date Aug 1, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230290699
- Publication date Sep 14, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20230070922
- Publication date Mar 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220077013
- Publication date Mar 10, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20200411397
- Publication date Dec 31, 2020
- Amkor Technology Singapore Holding Pte. Ltd.
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND RELATED METHODS
- Publication number 20200381395
- Publication date Dec 3, 2020
- Amkor Technology Singapore Holding Pte. Ltd
- Gyu Wan Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200294875
- Publication date Sep 17, 2020
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20180269121
- Publication date Sep 20, 2018
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20170338163
- Publication date Nov 23, 2017
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF
- Publication number 20160358007
- Publication date Dec 8, 2016
- Amkor Technology, Inc.
- Ji Young Chung
- G06 - COMPUTING CALCULATING COUNTING

Se Hwan Hong

Person

Patents Grantslast 30 patents

Sensor package and manufacturing method thereof

Semiconductor devices and related methods

Sensor package and manufacturing method thereof

Semiconductor devices and related methods

Semiconductor devices and related methods

Sensor package and manufacturing method thereof

Sensor package and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Fingerprint sensor and manufacturing method thereof

Patents Applicationslast 30 patents

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND RELATED METHODS

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND RELATED METHODS

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICES AND RELATED METHODS

SEMICONDUCTOR DEVICES AND RELATED METHODS

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF

FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF