Se Woong Cha

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 12,230,661
- Issue date Feb 18, 2025
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 12,033,910
- Issue date Jul 9, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,961,867
- Issue date Apr 16, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 11,508,712
- Issue date Nov 22, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 11,424,180
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 11,362,128
- Issue date Jun 14, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 10,867,984
- Issue date Dec 15, 2020
- Amkor Technology Singapore Holding Pte Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level stack chip package and method of manufacturing the same
- Patent number 10,784,178
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 10,692,918
- Issue date Jun 23, 2020
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 10,672,699
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 10,304,890
- Issue date May 28, 2019
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 10,290,621
- Issue date May 14, 2019
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 10,199,322
- Issue date Feb 5, 2019
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,115,705
- Issue date Oct 30, 2018
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabricating method thereof
- Patent number 9,831,282
- Issue date Nov 28, 2017
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with redistribution layers on partial encapsul...
- Patent number 9,818,685
- Issue date Nov 14, 2017
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a package-on-package type semiconductor pac...
- Patent number 9,741,701
- Issue date Aug 22, 2017
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package of finger print sensor and fabricating method thereof
- Patent number 9,431,447
- Issue date Aug 30, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 9,406,639
- Issue date Aug 2, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package of finger print sensor and fabricating method thereof
- Patent number 9,129,873
- Issue date Sep 8, 2015
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,123,543
- Issue date Sep 1, 2015
- Amkor Technology, Inc.
- Jung Gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan-out package with a fiducial die
- Patent number 8,946,883
- Issue date Feb 3, 2015
- Amkor Technology, Inc.
- Sung Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having redistribution layer
- Patent number 8,058,726
- Issue date Nov 15, 2011
- Amkor Technology, Inc.
- Jung Gi Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a land to absorb thermal and mechanica...
- Patent number 7,982,316
- Issue date Jul 19, 2011
- Amkor Technology, Inc.
- Min Woo Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240363470
- Publication date Oct 31, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20240347575
- Publication date Oct 17, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20230187432
- Publication date Jun 15, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20230057803
- Publication date Feb 23, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20220375985
- Publication date Nov 24, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20210175222
- Publication date Jun 10, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210020535
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210020679
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20200365504
- Publication date Nov 19, 2020
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190393258
- Publication date Dec 26, 2019
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20190312021
- Publication date Oct 10, 2019
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20190229050
- Publication date Jul 25, 2019
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20180138117
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180083061
- Publication date Mar 22, 2018
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20170373051
- Publication date Dec 28, 2017
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20160365379
- Publication date Dec 15, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20160322334
- Publication date Nov 3, 2016
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...
- Publication number 20160197032
- Publication date Jul 7, 2016
- Amkor Technology, Inc.
- Jong Sik Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20160133601
- Publication date May 12, 2016
- Amkor Technology, Inc.
- Yeong Beom Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Package-on-Package Type Semiconductor Pac...
- Publication number 20160056079
- Publication date Feb 25, 2016
- Amkor Technology, Inc.
- Dong Jin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
- Publication number 20150340399
- Publication date Nov 26, 2015
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF
- Publication number 20140138788
- Publication date May 22, 2014
- Amkor Technology, Inc.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Fan-Out Package With a Fiducial Die
- Publication number 20140077366
- Publication date Mar 20, 2014
- Sung Kyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Manufacturing Method Thereof
- Publication number 20140042600
- Publication date Feb 13, 2014
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Se Woong Cha

Person

Patents Grantslast 30 patents

Electronic device package and fabricating method thereof

Wafer-level stack chip package and method of manufacturing the same

Electronic device package and fabricating method thereof

Method of manufacturing a package-on-package type semiconductor pac...

Semiconductor device with redistribution layers on partial encapsul...

Electronic device package and fabricating method thereof

Method of manufacturing a package-on-package type semiconductor pac...

Wafer-level stack chip package and method of manufacturing the same

Electronic device package and fabricating method thereof

Semiconductor device with redistribution layers on partial encapsul...

Electronic device package and fabricating method thereof

Method of manufacturing a package-on-package type semiconductor pac...

Semiconductor device with redistribution layers on partial encapsul...

Semiconductor package and manufacturing method thereof

Electronic device package and fabricating method thereof

Semiconductor device with redistribution layers on partial encapsul...

Method of manufacturing a package-on-package type semiconductor pac...

Package of finger print sensor and fabricating method thereof

Semiconductor package and manufacturing method thereof

Package of finger print sensor and fabricating method thereof

Semiconductor device and manufacturing method thereof

Wafer level fan-out package with a fiducial die

Semiconductor device having redistribution layer

Semiconductor package having a land to absorb thermal and mechanica...

Patents Applicationslast 30 patents

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

ELECTRONIC DEVICE PACKAGE AND FABRICATING METHOD THEREOF

Semiconductor Package and Manufacturing Method Thereof

SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSUL...

WAFER-LEVEL STACK CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Method of Manufacturing a Package-on-Package Type Semiconductor Pac...

PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF

PACKAGE OF FINGER PRINT SENSOR AND FABRICATING METHOD THEREOF

Wafer Level Fan-Out Package With a Fiducial Die

Semiconductor Package and Manufacturing Method Thereof