Sean Cahill

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Mixed impedance leads for die packages and method of making the same
- Patent number 10,340,209
- Issue date Jul 2, 2019
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coated bond wires for die packages and methods of manufacturing sai...
- Patent number 9,997,489
- Issue date Jun 12, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalized molded plastic components for millimeter wave electronics...
- Patent number 9,960,468
- Issue date May 1, 2018
- REMEC BROADBAND WIRELESS NETWORKS, LLC
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat isolation structures for high bandwidth interconnects
- Patent number 9,859,188
- Issue date Jan 2, 2018
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die package with low electromagnetic interference interconnection
- Patent number 9,824,997
- Issue date Nov 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die packaging with fully or partially fused dielectric leads
- Patent number 9,812,420
- Issue date Nov 7, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate less die package having wires with dielectric and metal c...
- Patent number 9,711,479
- Issue date Jul 18, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device having a lead with selectively modified electrica...
- Patent number 9,673,137
- Issue date Jun 6, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 9,275,961
- Issue date Mar 1, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a high frequency device package
- Patent number 8,839,508
- Issue date Sep 23, 2014
- Rosenberger Hochfrequenztechnick GmbH & Co. KG
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost high frequency device package and methods
- Patent number 8,581,113
- Issue date Nov 12, 2013
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process of manufacturing high frequency device packages
- Patent number 7,520,054
- Issue date Apr 21, 2009
- Bridgewave Communications, Inc.
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro-electromechanical sensor
- Patent number 7,305,890
- Issue date Dec 11, 2007
- SMC Kabushiki Kaisha
- Art Zias
- G01 - MEASURING TESTING
Information Patent Grant
Micro-electromechanical sensor
- Patent number 7,047,814
- Issue date May 23, 2006
- Redwood Microsystems, Inc.
- Art Zias
- G01 - MEASURING TESTING
Information Patent Grant
High frequency device packages and methods
- Patent number 6,770,822
- Issue date Aug 3, 2004
- Bridgewave Communications, Inc.
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Micro circuits with a sculpted ground plane
- Patent number 6,667,549
- Issue date Dec 23, 2003
- Bridgewave Communications, Inc.
- Sean Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic packaging for semiconductor pressure sensors
- Patent number 6,351,996
- Issue date Mar 5, 2002
- Maxim Integrated Products, Inc.
- Steven S. Nasiri
- G01 - MEASURING TESTING
Information Patent Grant
Chip-scale packaged pressure sensor
- Patent number 6,346,742
- Issue date Feb 12, 2002
- Maxim Integrated Products, Inc.
- Janusz Bryzek
- G01 - MEASURING TESTING
Information Patent Grant
Compensated semiconductor pressure sensor
- Patent number 6,229,190
- Issue date May 8, 2001
- Maxim Integrated Products, Inc.
- Janusz Bryzek
- G01 - MEASURING TESTING
Information Patent Grant
Micromachined circuit elements driven by micromachined DC-to-DC con...
- Patent number 6,058,027
- Issue date May 2, 2000
- Maxim Integrated Products, Inc.
- Douglas A. Vargha
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Piezoresistive pressure sensor with sculpted diaphragm
- Patent number 6,006,607
- Issue date Dec 28, 1999
- Maxim Integrated Products, Inc.
- Janusz Bryzek
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor layer pressure switch
- Patent number 5,802,911
- Issue date Sep 8, 1998
- Tokyo Gas Co., Ltd.
- Sean Samuel Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preloaded linear beam vibration sensor
- Patent number 5,644,086
- Issue date Jul 1, 1997
- Tokyo Gas Co., Ltd.
- Sean Samuel Cahill
- G01 - MEASURING TESTING
Information Patent Grant
Preloaded linear beam vibration sensor and its manufacturing method
- Patent number 5,629,243
- Issue date May 13, 1997
- Tokyo Gas Co., Ltd.
- Sean S. Cahill
- G01 - MEASURING TESTING
Information Patent Grant
Varying apparent mass accelerometer
- Patent number 5,604,313
- Issue date Feb 18, 1997
- Tokyo Gas Co., Ltd.
- Sean S. Cahill
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
IPC COATING FOR PRINTHEAD
- Publication number 20240424788
- Publication date Dec 26, 2024
- FUJIFILM DIMATIX, INC.
- Sean Cahill
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PROCESS FOR AN IPC COATING
- Publication number 20240424791
- Publication date Dec 26, 2024
- FUJIFILM DIMATIX, INC.
- Shane Boyd
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
INK JET PRINT HEAD NOZZLE MATRIX LAYOUT
- Publication number 20240391238
- Publication date Nov 28, 2024
- FUJIFILM DIMATIX, INC.
- Daniel W. Barnett
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...
- Publication number 20180248242
- Publication date Aug 30, 2018
- REMEC BROADBAND WIRELESS NETWORKS, LLC
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170271296
- Publication date Sep 21, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...
- Publication number 20170125370
- Publication date May 4, 2017
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGING WITH FULLY OR PARTIALLY FUSED DIELECTRIC LEADS
- Publication number 20160379952
- Publication date Dec 29, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE PACKAGE WITH LOW ELECTROMAGNETIC INTERFERENCE INTERCONNECTION
- Publication number 20160379954
- Publication date Dec 29, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...
- Publication number 20160372440
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED IMPEDANCE LEADS FOR DIE PACKAGES AND METHOD OF MAKING THE SAME
- Publication number 20160372402
- Publication date Dec 22, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICA...
- Publication number 20160190047
- Publication date Jun 30, 2016
- Rosenberger Hochfrequenztechnik GmbH & Co. KG
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...
- Publication number 20140070904
- Publication date Mar 13, 2014
- Sean S. Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120234588
- Publication date Sep 20, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MILLIMETER WAVE RADIO ASSEMBLY WITH A COMPACT ANTENNA
- Publication number 20120154239
- Publication date Jun 21, 2012
- Bridgewave Communications, Inc.
- Idan Bar-Sade
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS
- Publication number 20120066894
- Publication date Mar 22, 2012
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Cost High Frequency Device Package and Methods
- Publication number 20090159320
- Publication date Jun 25, 2009
- Bridgewave Communications, Inc.
- Eric A. Sanjuan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-electromechanical sensor
- Publication number 20060117857
- Publication date Jun 8, 2006
- Redwood Microsystems, Inc.
- Art Zias
- G01 - MEASURING TESTING
Information Patent Application
MICRO CIRCUITS WITH A SCULPTED GROUND PLANE
- Publication number 20030206261
- Publication date Nov 6, 2003
- Bridge Wave Communications, Inc.
- Sean Cahill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High frequency device packages and methods
- Publication number 20030168250
- Publication date Sep 11, 2003
- BridgeWave Communications, Inc.
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
High frequency device packages and methods
- Publication number 20030159262
- Publication date Aug 28, 2003
- Eliezer Pasternak
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Micro-electromechanical sensor
- Publication number 20030072127
- Publication date Apr 17, 2003
- Art Zias
- G01 - MEASURING TESTING

Sean Cahill

Person

Patents Grantslast 30 patents

Mixed impedance leads for die packages and method of making the same

Coated bond wires for die packages and methods of manufacturing sai...

Metalized molded plastic components for millimeter wave electronics...

Heat isolation structures for high bandwidth interconnects

Die package with low electromagnetic interference interconnection

Die packaging with fully or partially fused dielectric leads

Substrate less die package having wires with dielectric and metal c...

Electronic device having a lead with selectively modified electrica...

Low cost high frequency device package and methods

Method of making a high frequency device package

Low cost high frequency device package and methods

Process of manufacturing high frequency device packages

Micro-electromechanical sensor

Micro-electromechanical sensor

High frequency device packages and methods

Micro circuits with a sculpted ground plane

Hermetic packaging for semiconductor pressure sensors

Chip-scale packaged pressure sensor

Compensated semiconductor pressure sensor

Micromachined circuit elements driven by micromachined DC-to-DC con...

Piezoresistive pressure sensor with sculpted diaphragm

Semiconductor layer pressure switch

Preloaded linear beam vibration sensor

Preloaded linear beam vibration sensor and its manufacturing method

Varying apparent mass accelerometer

Patents Applicationslast 30 patents

IPC COATING FOR PRINTHEAD

PROCESS FOR AN IPC COATING

INK JET PRINT HEAD NOZZLE MATRIX LAYOUT

METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

COATED BOND WIRES FOR DIE PACKAGES AND METHODS OF MANUFACTURING SAI...

DIE PACKAGING WITH FULLY OR PARTIALLY FUSED DIELECTRIC LEADS

DIE PACKAGE WITH LOW ELECTROMAGNETIC INTERFERENCE INTERCONNECTION

A SUBSTRATE LESS DIE PACKAGE HAVING WIRES WITH DIELECTRIC AND METAL...

MIXED IMPEDANCE LEADS FOR DIE PACKAGES AND METHOD OF MAKING THE SAME

ELECTRONIC DEVICE HAVING A LEAD WITH SELECTIVELY MODIFIED ELECTRICA...

METALIZED MOLDED PLASTIC COMPONENTS FOR MILLIMETER WAVE ELECTRONICS...

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

MILLIMETER WAVE RADIO ASSEMBLY WITH A COMPACT ANTENNA

LOW COST HIGH FREQUENCY DEVICE PACKAGE AND METHODS

Low Cost High Frequency Device Package and Methods

Micro-electromechanical sensor

MICRO CIRCUITS WITH A SCULPTED GROUND PLANE

High frequency device packages and methods

High frequency device packages and methods

Micro-electromechanical sensor