SEAN KANG

Person

San Ramond, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Gas delivery system for high pressure processing chamber
- Patent number 11,756,803
- Issue date Sep 12, 2023
- Applied Materials, Inc.
- Qiwei Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten defluorination by high pressure treatment
- Patent number 11,705,337
- Issue date Jul 18, 2023
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas delivery system for high pressure processing chamber
- Patent number 11,527,421
- Issue date Dec 13, 2022
- Micromaterials, LLC
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of enhancing etching selectivity using a pulsed plasma
- Patent number 11,495,470
- Issue date Nov 8, 2022
- Applied Materials, Inc.
- Hailong Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for in-situ protection liners for high aspect...
- Patent number 11,373,877
- Issue date Jun 28, 2022
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 11,164,723
- Issue date Nov 2, 2021
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 10,930,471
- Issue date Feb 23, 2021
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure treatment of silicon nitride film
- Patent number 10,847,360
- Issue date Nov 24, 2020
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas delivery system for high pressure processing chamber
- Patent number 10,720,341
- Issue date Jul 21, 2020
- Micromaterials, LLC
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Seam-healing method upon supra-atmospheric process in diffusion pro...
- Patent number 10,636,704
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten defluorination by high pressure treatment
- Patent number 10,622,214
- Issue date Apr 14, 2020
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for etching semiconductor structures
- Patent number 10,593,518
- Issue date Mar 17, 2020
- Applied Materials, Inc.
- Daisuke Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 10,529,603
- Issue date Jan 7, 2020
- Micromaterials, LLC
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Atomic layer etching processes
- Patent number 10,424,487
- Issue date Sep 24, 2019
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for fabricating nanowire for semiconductor applications
- Patent number 10,269,571
- Issue date Apr 23, 2019
- Applied Materials, Inc.
- Keith Tatseun Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airgap formation with damage-free copper
- Patent number 10,242,908
- Issue date Mar 26, 2019
- Applied Materials, Inc.
- Sean Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pressure wafer processing systems and related methods
- Patent number 10,224,224
- Issue date Mar 5, 2019
- Micromaterials, LLC
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for controlling substrate uniformity
- Patent number 10,177,050
- Issue date Jan 8, 2019
- Applied Materials, Inc.
- S. M. Reza Sadjadi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Poly directional etch by oxidation
- Patent number 10,062,575
- Issue date Aug 28, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seam-healing method upon supra-atmospheric process in diffusion pro...
- Patent number 10,049,927
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Bencherki Mebarki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,721,807
- Issue date Aug 1, 2017
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming features in a material layer utilizing a combin...
- Patent number 9,543,163
- Issue date Jan 10, 2017
- Applied Materials, Inc.
- Mang-Mang Ling
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for controlling Fin recess loading
- Patent number 9,520,302
- Issue date Dec 13, 2016
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for barrier layer removal
- Patent number 9,514,953
- Issue date Dec 6, 2016
- Applied Materials, Inc.
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cyclic spacer etching process with improved profile control
- Patent number 9,478,433
- Issue date Oct 25, 2016
- Applied Materials, Inc.
- Qingjun Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for controlling substrate uniformity
- Patent number 9,412,579
- Issue date Aug 9, 2016
- Applied Materials, Inc.
- S. M. Reza Sadjadi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming a self-aligned contact via selective lateral etch
- Patent number 9,368,369
- Issue date Jun 14, 2016
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for etching a dielectric barrier layer in a dual damascene...
- Patent number 9,299,577
- Issue date Mar 29, 2016
- Applied Materials, Inc.
- He Ren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spacer formation
- Patent number 9,269,590
- Issue date Feb 23, 2016
- Applied Materials, Inc.
- Olivier Luere
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing a metal hardmask
- Patent number 9,006,106
- Issue date Apr 14, 2015
- Applied Materials, Inc.
- Chia-Ling Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OXIDATION ENHANCED DOPING
- Publication number 20240145246
- Publication date May 2, 2024
- Applied Materials, Inc.
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT
- Publication number 20230298893
- Publication date Sep 21, 2023
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
BIAS VOLTAGE MODULATION APPROACH FOR SiO/SiN LAYER ALTERNATING ETCH...
- Publication number 20230223268
- Publication date Jul 13, 2023
- Applied Materials, Inc.
- Sean KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR HIGH PRESSURE PROCESSING CHAMBER
- Publication number 20230093374
- Publication date Mar 23, 2023
- Micromaterials, LLC.
- Qiwei LIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRESS AND OVERLAY MANAGEMENT FOR SEMICONDUCTOR PROCESSING
- Publication number 20220344282
- Publication date Oct 27, 2022
- Applied Materials, Inc.
- Pradeep K. Subrahmanyan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ENHANCING ETCHING SELECTIVITY USING A PULSED PLASMA
- Publication number 20220336222
- Publication date Oct 20, 2022
- Applied Materials, Inc.
- Hailong ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR IN-SITU PROTECTION LINERS FOR HIGH ASPECT...
- Publication number 20210320012
- Publication date Oct 14, 2021
- Applied Materials, Inc.
- Daisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20210142987
- Publication date May 13, 2021
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS DELIVERY SYSTEM FOR HIGH PRESSURE PROCESSING CHAMBER
- Publication number 20200350183
- Publication date Nov 5, 2020
- Micromaterials, LLC.
- Qiwei LIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
MULTIZONE FLOW DISTRIBUTION SYSTEM
- Publication number 20200312680
- Publication date Oct 1, 2020
- Applied Materials Inc.
- DAISUKE SHIMIZU
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES
- Publication number 20200294771
- Publication date Sep 17, 2020
- Applied Materials, Inc.
- DAISUKE SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT
- Publication number 20200098574
- Publication date Mar 26, 2020
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS AND METHODS FOR ETCHING OXIDE NITRIDE STACKS
- Publication number 20190362983
- Publication date Nov 28, 2019
- Applied Materials, Inc.
- Daisuke SHIMIZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS
- Publication number 20190198367
- Publication date Jun 27, 2019
- Micromaterials, LLC.
- Qiwei LIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
GAS DELIVERY SYSTEM FOR HIGH PRESSURE PROCESSING CHAMBER
- Publication number 20190148178
- Publication date May 16, 2019
- Micromaterials, LLC.
- Qiwei LIANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ATOMIC LAYER ETCHING PROCESSES
- Publication number 20190122902
- Publication date Apr 25, 2019
- Applied Materials, Inc.
- Jungmin Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM-HEALING METHOD UPON SUPRA-ATMOSPHERIC PROCESS IN DIFFUSION PRO...
- Publication number 20190051557
- Publication date Feb 14, 2019
- Applied Materials, Inc.
- Bencherki MEBARKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FABRICATING NANOWIRE FOR SEMICONDUCTOR APPLICATIONS
- Publication number 20190019681
- Publication date Jan 17, 2019
- Applied Materials, Inc.
- Keith Tatseun WONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE TREATMENT OF SILICON NITRIDE FILM
- Publication number 20180342384
- Publication date Nov 29, 2018
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT
- Publication number 20180342396
- Publication date Nov 29, 2018
- Applied Materials, Inc.
- Keith Tatseun Wong
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS
- Publication number 20180261480
- Publication date Sep 13, 2018
- Applied Materials, Inc.
- Qiwei LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS
- Publication number 20180258533
- Publication date Sep 13, 2018
- Micromaterials LLC.
- Qiwei Liang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
AIRGAP FORMATION WITH DAMAGE-FREE COPPER
- Publication number 20180138075
- Publication date May 17, 2018
- Applied Materials, Inc.
- Sean Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLY DIRECTIONAL ETCH BY OXIDATION
- Publication number 20180076044
- Publication date Mar 15, 2018
- Applied Materials, Inc.
- Tom Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEAM-HEALING METHOD UPON SUPRA-ATMOSPHERIC PROCESS IN DIFFUSION PRO...
- Publication number 20170358490
- Publication date Dec 14, 2017
- Applied Materials, Inc.
- Bencherki MEBARKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED METROLOGY AND PROCESS TOOL TO ENABLE LOCAL STRESS/OVERLA...
- Publication number 20170287752
- Publication date Oct 5, 2017
- Applied Materials, Inc.
- Ludovic GODET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR CONTROLLING SUBSTRATE UNIFORMITY
- Publication number 20160329256
- Publication date Nov 10, 2016
- Applied Materials, Inc.
- S. M. Reza SADJADI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293437
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL
- Publication number 20160293438
- Publication date Oct 6, 2016
- Applied Materials, Inc.
- Qingjun ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONTROLLING FIN RECESS LOADING
- Publication number 20160133459
- Publication date May 12, 2016
- Applied Materials, Inc.
- JUNGMIN KO
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Gas delivery system for high pressure processing chamber

Tungsten defluorination by high pressure treatment

Gas delivery system for high pressure processing chamber

Method of enhancing etching selectivity using a pulsed plasma

Methods and apparatus for in-situ protection liners for high aspect...

Methods and apparatus for etching semiconductor structures

Methods and apparatus for etching semiconductor structures

High pressure treatment of silicon nitride film

Gas delivery system for high pressure processing chamber

Seam-healing method upon supra-atmospheric process in diffusion pro...

Tungsten defluorination by high pressure treatment

Methods and apparatus for etching semiconductor structures

High pressure wafer processing systems and related methods

Atomic layer etching processes

Methods for fabricating nanowire for semiconductor applications

Airgap formation with damage-free copper

High pressure wafer processing systems and related methods

Methods and apparatus for controlling substrate uniformity

Poly directional etch by oxidation

Seam-healing method upon supra-atmospheric process in diffusion pro...

Cyclic spacer etching process with improved profile control

Methods for forming features in a material layer utilizing a combin...

Methods for controlling Fin recess loading

Methods for barrier layer removal

Cyclic spacer etching process with improved profile control

Methods and apparatus for controlling substrate uniformity

Methods for forming a self-aligned contact via selective lateral etch

Methods for etching a dielectric barrier layer in a dual damascene...

Spacer formation

Method of removing a metal hardmask

Patents Applicationslast 30 patents

OXIDATION ENHANCED DOPING

TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT

BIAS VOLTAGE MODULATION APPROACH FOR SiO/SiN LAYER ALTERNATING ETCH...

GAS DELIVERY SYSTEM FOR HIGH PRESSURE PROCESSING CHAMBER

STRESS AND OVERLAY MANAGEMENT FOR SEMICONDUCTOR PROCESSING

METHOD OF ENHANCING ETCHING SELECTIVITY USING A PULSED PLASMA

METHODS AND APPARATUS FOR IN-SITU PROTECTION LINERS FOR HIGH ASPECT...

METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES

GAS DELIVERY SYSTEM FOR HIGH PRESSURE PROCESSING CHAMBER

MULTIZONE FLOW DISTRIBUTION SYSTEM

METHODS AND APPARATUS FOR ETCHING SEMICONDUCTOR STRUCTURES

TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT

SYSTEMS AND METHODS FOR ETCHING OXIDE NITRIDE STACKS

HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS

GAS DELIVERY SYSTEM FOR HIGH PRESSURE PROCESSING CHAMBER

ATOMIC LAYER ETCHING PROCESSES

SEAM-HEALING METHOD UPON SUPRA-ATMOSPHERIC PROCESS IN DIFFUSION PRO...

METHODS FOR FABRICATING NANOWIRE FOR SEMICONDUCTOR APPLICATIONS

HIGH PRESSURE TREATMENT OF SILICON NITRIDE FILM

TUNGSTEN DEFLUORINATION BY HIGH PRESSURE TREATMENT

HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS

HIGH PRESSURE WAFER PROCESSING SYSTEMS AND RELATED METHODS

AIRGAP FORMATION WITH DAMAGE-FREE COPPER

POLY DIRECTIONAL ETCH BY OXIDATION

SEAM-HEALING METHOD UPON SUPRA-ATMOSPHERIC PROCESS IN DIFFUSION PRO...

INTEGRATED METROLOGY AND PROCESS TOOL TO ENABLE LOCAL STRESS/OVERLA...

METHODS AND APPARATUS FOR CONTROLLING SUBSTRATE UNIFORMITY

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

CYCLIC SPACER ETCHING PROCESS WITH IMPROVED PROFILE CONTROL

METHODS FOR CONTROLLING FIN RECESS LOADING