Sean Lian

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Allentown, PA, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods and apparatus for determining pad height for a wire-bonding...
- Patent number 7,705,473
- Issue date Apr 27, 2010
- Agere Systems Inc.
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization performance in electronic devices
- Patent number 7,339,274
- Issue date Mar 4, 2008
- Agere Systems Inc.
- John C. Desko, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for determining pad height for a wire-bonding...
- Patent number 7,056,819
- Issue date Jun 6, 2006
- Agere Systems Inc.
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making enhanced substrate contact for a semiconductor de...
- Patent number 6,987,052
- Issue date Jan 17, 2006
- Agere Systems Inc.
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for the detection of damaged regions on diele...
- Patent number 6,919,228
- Issue date Jul 19, 2005
- Agere Systems, INC
- Sean Lian
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Methods and apparatus for determining pad height for a wire-bonding...
- Publication number 20060157871
- Publication date Jul 20, 2006
- Agere Systems Inc.
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallization performance in electronic devices
- Publication number 20060038294
- Publication date Feb 23, 2006
- John C. Desko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR THE DETECTION OF DAMAGED REGIONS ON DIELE...
- Publication number 20050092987
- Publication date May 5, 2005
- Sean Lian
- G01 - MEASURING TESTING
Information Patent Application
Enhanced substrate contact for a semiconductor device
- Publication number 20050093097
- Publication date May 5, 2005
- Frank A. Baiocchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatus for determining pad height for a wire-bonding...
- Publication number 20050067678
- Publication date Mar 31, 2005
- Sean Lian
- H01 - BASIC ELECTRIC ELEMENTS