Sebastian PAHLKE

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Regensburg, DE

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Patents Grantslast 30 patents

Information Patent Grant
Chip carrier laminate with high frequency dielectric and thermomech...
- Patent number 10,607,911
- Issue date Mar 31, 2020
- Infineon Technologies AG
- Martin Richard Niessner
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Chip carrier laminate with high frequency dielectric and thermomech...
- Publication number 20160211189
- Publication date Jul 21, 2016
- INFINEON TECHNOLOGIES AG
- Martin Richard NIESSNER
- H01 - BASIC ELECTRIC ELEMENTS