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Sebastian T. M. Soon
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Multichip module package and fabrication method
Patent number
7,928,564
Issue date
Apr 19, 2011
Stats Chippac Ltd.
IL Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip module package and fabrication method
Patent number
7,445,955
Issue date
Nov 4, 2008
Stats Chippac Ltd.
IL Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multichip module package and fabrication method
Patent number
6,943,057
Issue date
Sep 13, 2005
Stats Chippac Ltd.
IL Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
Publication number
20090014866
Publication date
Jan 15, 2009
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTICHIP MODULE PACKAGE AND FABRICATION METHOD
Publication number
20060043560
Publication date
Mar 2, 2006
STATS ChipPAC Ltd.
IL Kwon SHIM
H01 - BASIC ELECTRIC ELEMENTS