Sebastien Quesnel

Follow

Person

Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Flip-chip bonder with induction coils and a heating element
- Patent number 9,875,985
- Issue date Jan 23, 2018
- International Business Machines Corporation
- Jae-woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump reflow by induction heating
- Patent number 9,190,375
- Issue date Nov 17, 2015
- GLOBALFOUNDRIES, INC.
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reducing thermal energy transfer during chip-join processing
- Patent number 9,177,931
- Issue date Nov 3, 2015
- GlobalFoundries U.S. 2 LLC
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP BONDER WITH INDUCTION COILS
- Publication number 20160141264
- Publication date May 19, 2016
- International Business Machines Corporation
- Jae-woong Nah
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP REFLOW BY INDUCTION HEATING
- Publication number 20150294948
- Publication date Oct 15, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCING THERMAL ENERGY TRANSFER DURING CHIP-JOIN PROCESSING
- Publication number 20150243618
- Publication date Aug 27, 2015
- International Business Machines Corporation
- Stephen P. Ayotte
- H01 - BASIC ELECTRIC ELEMENTS