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Patents Grantslast 30 patents

Information Patent Grant
Electromagnetic shield of an integrated circuit package
- Patent number 12,137,545
- Issue date Nov 5, 2024
- Hewlett Packard Enterprise Development LP
- See Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chassis having an insertion key assembly for a pluggable module
- Patent number 11,855,381
- Issue date Dec 26, 2023
- Hewlett Packard Enterprise Development LP
- See Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided fan tray assembly of an electronic system
- Patent number 11,576,278
- Issue date Feb 7, 2023
- Hewlett Packard Enterprise Development LP
- See Yun Yow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTROMAGNETIC SHIELD OF AN INTEGRATED CIRCUIT PACKAGE
- Publication number 20240098952
- Publication date Mar 21, 2024
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP.
- See Yun Yow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHASSIS HAVING AN INSERTION KEY ASSEMBLY FOR A PLUGGABLE MODULE
- Publication number 20230261410
- Publication date Aug 17, 2023
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- See Yun Yow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED FAN TRAY ASSEMBLY OF AN ELECTRONIC SYSTEM
- Publication number 20220225535
- Publication date Jul 14, 2022
- HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- See Yun Yow
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR