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CMP pad conditioner
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Patent number 10,166,653
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Issue date Jan 1, 2019
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EHWA DIAMOND INDUSTRIAL CO., LTD.
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Seh Kwang Lee
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B24 - GRINDING POLISHING
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CMP apparatus
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Patent number 9,421,668
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Issue date Aug 23, 2016
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EHWA DIAMOND INDUSTRIAL CO., LTD.
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Seh Kwang Lee
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B24 - GRINDING POLISHING
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Microreactors
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Patent number 8,187,553
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Issue date May 29, 2012
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EMPIRE TECHNOLOGY DEVELOPMENT LLC
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Seh Kwang Lee
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B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL