SEHOON JANG

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Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20240153906
- Publication date May 9, 2024
- Samsung Electronics Co., Ltd.
- Byeongtak PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240145396
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sehoon JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240047324
- Publication date Feb 8, 2024
- Samsung Electronics Co., Ltd.
- Hyeonjeong HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
- Publication number 20240038536
- Publication date Feb 1, 2024
- Samsung Electronics Co., Ltd.
- YONGIN LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE OF FAN-OUT TYPE SEMICONDUCTOR PACKAGE
- Publication number 20230223309
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- SEHOON JANG
- H01 - BASIC ELECTRIC ELEMENTS