Sehoon Yoo

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Incheon, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for filling a wafer via with solder
- Patent number 10,115,635
- Issue date Oct 30, 2018
- Korea Institute of Industrial Technology
- Sehoon Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for filling a wafer via with solder
- Patent number 9,603,254
- Issue date Mar 21, 2017
- Korea Institute of Industrial Technology
- Sehoon Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STATOR OF ROTATING ELECTRIC MACHINE
- Publication number 20240322632
- Publication date Sep 26, 2024
- LG Magna e-Powertrain Co., Ltd.
- Seokhwan KIM
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
METHOD FOR FILLING A WAFER VIA WITH SOLDER
- Publication number 20180301377
- Publication date Oct 18, 2018
- KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Sehoon Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR FILLING A WAFER VIA WITH SOLDER
- Publication number 20170148678
- Publication date May 25, 2017
- KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Sehoon Yoo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR FILLING A WAFER VIA WITH SOLDER AND HAVING A PRESSURE...
- Publication number 20140123488
- Publication date May 8, 2014
- KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Sehoon Yoo
- H01 - BASIC ELECTRIC ELEMENTS