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Seigo Murakami
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Tokyo, JP
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Patents Grants
last 30 patents
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Patent Grant
Thin section preparation device
Patent number
9,983,100
Issue date
May 29, 2018
Sakura Finetek Japan Co., Ltd
Tatsuya Miyatani
G01 - MEASURING TESTING
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Patent Grant
Block storage device and automatic thin-cutting device
Patent number
9,423,325
Issue date
Aug 23, 2016
Sakura Finetek Japan Co., Ltd
Jyunya Enomoto
G01 - MEASURING TESTING
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Patent Grant
Sample crushing and pulverizing apparatus
Patent number
D604343
Issue date
Nov 17, 2009
Hirata Corporation
Seigo Murakami
D15 - Machines not elsewhere specified
Patents Applications
last 30 patents
Information
Patent Application
THIN SECTION PREPARATION DEVICE
Publication number
20150300924
Publication date
Oct 22, 2015
SAKURA FINETEK JAPAN CO., LTD.
Tatsuya MIYATANI
G01 - MEASURING TESTING
Information
Patent Application
BLOCK STORAGE DEVICE AND AUTOMATIC THIN-CUTTING DEVICE
Publication number
20150292992
Publication date
Oct 15, 2015
SAKURA FINETEK JAPAN CO., LTD.
Jyunya Enomoto
G01 - MEASURING TESTING