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Tokyo, JP
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last 30 patents
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Patent Grant
Plastic-sealed IC device of heat-resistant construction
Patent number
4,866,506
Issue date
Sep 12, 1989
Oki Electric Industry Co., Ltd.
Seigo Nambu
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Heat-resistant plastic semiconductor device
Patent number
4,777,520
Issue date
Oct 11, 1988
Oki Electric Industry Co. Ltd.
Seigo Nambu
H01 - BASIC ELECTRIC ELEMENTS