Seiichi Abe

Follow

Person

Chiba, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Apparatus for collecting wafers
- Patent number 4,974,577
- Issue date Dec 4, 1990
- Mitsubishi Kinzoku Kabushiki Kaisha
- Seiichi Abe
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method of and apparatus for dressing cutting edge of cut-off wheel
- Patent number 4,926,836
- Issue date May 22, 1990
- Mitsubishi Kinzoku Kabushiki Kaisha
- Seiichi Abe
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for collecting wafers
- Patent number 4,899,719
- Issue date Feb 13, 1990
- Mitsubishi Kinsoku Kabushiki Kaisha
- Seiichi Abe
- B28 - WORKING CEMENT, CLAY, OR STONE