Seiichi Akagi

Person

Ibaraki, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sealant epoxy-resin molding material, and electronic component device
- Patent number 7,846,998
- Issue date Dec 7, 2010
- Hitachi Chemical Co., Ltd.
- Seiichi Akagi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Phenyl, naphthly or fluorene cyclopentyl epoxy resins
- Patent number 6,713,589
- Issue date Mar 30, 2004
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Phenyl, naphthyl or fluorene cyclopentyl epoxy resins
- Patent number 6,329,492
- Issue date Dec 11, 2001
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Phenolic resin, resin composition, molding material for encapsulati...
- Patent number 6,207,789
- Issue date Mar 27, 2001
- Hitachi Chemical Co., Ltd.
- Haruaki Sue
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT...
- Publication number 20090143511
- Publication date Jun 4, 2009
- HITACHI CHEMICAL CO., Ltd.
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE
- Publication number 20090137717
- Publication date May 28, 2009
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Epoxy Resin Composition for Sealing and Electronic Component Device
- Publication number 20090062430
- Publication date Mar 5, 2009
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Sealant Epoxy-Resin Molding Material, and Electronic Component Device
- Publication number 20080234409
- Publication date Sep 25, 2008
- Hitachi Chemical Co., Ltd.
- Seiichi Akagi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Encapsulated Epoxy-Resin Molding Compound, And Electronic Component...
- Publication number 20080039556
- Publication date Feb 14, 2008
- HITACHI CHEMICAL CO., Ltd.
- Ryoichi Ikezawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Cyclopentylene compound and intermediate thereof, epoxy resin compo...
- Publication number 20020065386
- Publication date May 30, 2002
- Hitachi Chemical Company, Ltd.
- Haruaki Sue
- C07 - ORGANIC CHEMISTRY

Seiichi Akagi

Person

Patents Grantslast 30 patents

Sealant epoxy-resin molding material, and electronic component device

Phenyl, naphthly or fluorene cyclopentyl epoxy resins

Phenyl, naphthyl or fluorene cyclopentyl epoxy resins

Phenolic resin, resin composition, molding material for encapsulati...

Patents Applicationslast 30 patents

ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT...

ENCAPSULATED EPOXY RESIN COMPOSITION AND ELECTRONIC COMPONENT DEVICE

Epoxy Resin Composition for Sealing and Electronic Component Device

Sealant Epoxy-Resin Molding Material, and Electronic Component Device

Encapsulated Epoxy-Resin Molding Compound, And Electronic Component...

Cyclopentylene compound and intermediate thereof, epoxy resin compo...